Integrated rack solutions and live demonstrations will show how TE Connectivity is helping address the growing bandwidth, density, power and thermal demands of next-generation AI systems
Published
10/09/26
October 9, 2026
HARRISBURG, Pa.
TE Connectivity, a world leader in connectors and sensors, will showcase a broad portfolio of connectivity and power technologies for next-generation AI infrastructure at the 2026 OCP Global Summit from Oct. 12–15 in San Jose, California. Visitors can meet with TE at booth D3 to explore how the company is helping customers scale bandwidth, density, power delivery and thermal performance across increasingly complex AI systems.
As AI workloads drive rapid increases in compute density, data rates and rack power, infrastructure designers must address electrical, optical and thermal challenges as one interconnected system. TE’s OCP showcase brings these technologies together through three system-level racks, a high-current power demonstration and seven demonstrations spanning 224G to 448G connectivity, PCIe Gen 7, near-package optics and liquid cooling.
“AI infrastructure is scaling rapidly, creating increasingly complex challenges across connectivity, power and thermal management,” said TE Vice President of Product Management Brian Payne. “TE partners closely with customers to solve these challenges at the system level, combining deep engineering expertise with a broad portfolio of connectivity and infrastructure solutions. Together, we are enabling the scalable, high-performance architectures that will power the next frontier of AI.”
System-Level Innovation for AI Infrastructure
TE’s three system-level rack exhibits will show how critical technologies can work together across AI infrastructure:
- End-to-end optical interconnect solutions: Integrating near-package optics, optical modules, high-density fiber routing, optical backplane connectivity, and liquid cooling.
- Next-generation power delivery: A sidecar power rack illustrating the evolution from today’s 48V architecture to emerging 800V DC distribution, with rack-to-rack power connectivity for optical and copper IT systems.
- High-speed copper connectivity: A copper IT rack featuring TE’s new high-density STRADA Whisper Ultra 336G backplane and mid-plane solutions, PCIe Gen 7 and front-panel-to-chip technology.
Demonstrations Advance Connectivity, Power and Cooling
Seven demonstrations will give visitors a closer look at key technology transitions shaping AI systems.
TE is bringing its latest innovations to OCP, including a high-current hybrid busbar that will feature a new high-current, hybrid liquid- and air-cooled power distribution architecture designed for the growing power and thermal demands of AI racks. Additionally, TE’s new 448G solutions will showcase a one-meter copper channel connecting co-packaged copper to a high-speed cabled backplane, and liquid-cooled I/O to address the thermal challenges of emerging architectures.
A live demonstration will show a PCIe Gen 7 signal path through TE’s Ultra Low-Profile (ULP) connector and cable assembly, highlighting a high-speed internal connectivity approach for next-generation architectures.
Additional innovations at TE’s booth will include:
- 224G OSFP active electrical cable with retimer technology to extend copper reach at high speed.
- Smart busbar connectivity with added real-time current, temperature and leakage monitoring.
- Modular socket architecture supporting near-package optical engines and high-speed copper connectivity.
“Our strong ecosystem partnerships are helping accelerate scalable AI infrastructure, and we invite OCP attendees to visit us at booth D3 to see that collaboration in action,” commented TE Vice President of Global Sales and Marketing Bob Smithmyer.
Additional Information
Visit te.com/ocp-2026 for additional details about TE’s products, demonstrations and presentations at OCP. Further information on TE’s AI solutions can be found at te.com/AI.
About TE Connectivity
TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence, and more. Our more than 90,000 employees, including 10,000 engineers, work alongside customers in approximately 130 countries. In a world that is racing ahead, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Instagram.
