OCP Global Summit 2026

Engineering the Future of AI

Join TE Connectivity (TE) at OCP Global Summit 2026, booth #D3, to learn more about our broad portfolio of interconnect solutions designed for higher speeds, higher density scalability, and power efficiency in data center architectures. 

Portfolio Solutions on Display at OCP Global Summit 2026

• Rack-level connectivity featuring end-to-end optical architecture, high-speed copper connectivity, and next-generation power delivery

• High-current, hybrid liquid- and air-cooled power distribution architecture designed for the growing power and thermal demands of AI racks

• Smart busbar connectivity with real-time current, temperature and leakage monitoring

• 224G active electrical cable technology designed to extend copper reach

• Liquid-cooled high-speed I/O for 224G and emerging 448G architectures

• 448G co-packaged copper to high-speed cabled backplane

• Modular socket architecture supporting near-package optical engines and high-speed copper connectivity

• Ultra low-profile PCIe Gen 7 signal path through TE internal connectors and cable assemblies

Hear From Our Experts

• Solving Power Density & Bandwidth Challenges in AI Infrastructure
• Reducing Parasitics, Improving Performance: The Case for Low Inductance Interconnects
• Co-Packaged Copper at 448G: Balancing Electrical Efficiency with System Level Complexity
• PANEL: 400G/Lane Optics Module Connectors
• PANEL: Standards and Future Technologies
• Cooling the 448G Frontier: Thermal Architecture for 500 W-Class HSIO Using Direct-to-Chip Liquid Cooling
• Enabling 1MW+ IT rack power with an open rack busbar interface