Empowering AI & Data Center Connectivity For Next-Gen Speed, Efficiency, and Reliability
Connectivity Solutions Empowering the AI Evolution
Learn how TE is helping to empower the AI evolution with our robust portfolio of interconnect solutions.
Advancing End-to-End Optics for AI Data Centers
At the 2026 OFC Conference, TE Digital Data Networks VP and CTO Mike Tryson speaks with Lightwave’s Ana Berry about AI data center trends and how TE is advancing end-to-end infrastructure across optics, copper, power, and liquid cooling, including its expanded optics portfolio.
Scaling Data Centers for the AI Era
AI is transforming data centers. In this video, Ganesh Srinivasan, VP of Product Management at TE, explains how TE enables customers to scale AI workloads with advanced interconnect, power, and cooling solutions—backed by deep ecosystem partnerships and a resilient global supply chain.
AI Data Center Portfolio
VISIT AI VIRITUAL SHOWROOMConnectivity Solutions for AI Data Centers
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Power Infrastructure Solutions
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Our product portfolio
- High-Speed I/O Cables & Connectors
- Backplane Connectors & Cable Assemblies
- Over-the-Board Connectors & Cable Solutions
- Power Connectors & Cable Solutions
- Internal Cabled Interconnects
- IC & Memory Sockets
- 112G Portfolio Solutions
- 224G Portfolio Solutions
- Open Compute Project (OCP) Solutions
- Optical Solutions
Latest Insights and Innovations
HVDC: Redefining Data Center Performance and Sustainability
This white paper explores the escalating data center power requirements, the advent of HVDC, and how TE is paving the way for some next-gen designs.
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Scaling End-to-End Optical Interconnects for AI Data Centers
At OFC 2026, Pranav Garg, VP of Strategy, Business Development and Incubation spoke with Fiber Systems about how TE brings innovation to system-level challenges by scaling end-to-end optical interconnects for AI data centers.
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Accelerating the Deployment of Next-generation AI Infrastructure
At the 2025 Open Compute Project (OCP) Global Summit, TE Vice President of Product Management, Ganesh Srinivasan, spoke with EE Times Editor in Chief, Nitin Dahad, about the rapidly evolving needs of next generation data centers. Watch the interview on EE Times’ YouTube channel now.
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The Evolution of Data Centers and the Future of Cooling and Connectivity
This trend paper explores how data centers are evolving to meet increasing power and cooling demands, with a focus on new design approaches and connectivity solutions.
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Open Compute Project (OCP) Power Distribution Solutions
TE’s OCP power solutions offering.
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Power Systems for Next-Generation Data Centers
Explore how evolving power architectures support high-density AI compute and modern rack-level distribution.
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Socket and Mating Connectors
- High-density, high-speed signal launch from the source
- Near-chip connector utilizing uLGA socket technology
- 224G signal integrity performance
- Customization available
Cabled Backplane Connectors
- Enables all-to-all communication between AI Chips
- Hermaphroditic mating interface for 224G performance
- Operates at 224G PAM-4 data rates with 92 Ohm impedance
- Mating force required including 1.0 N/DP, with a durability of 200 cycles
- Optimized for 26 to 32 AWG cabled backplane architectures
- Reliable, scalable & customizable end-to-end power solution
- Highly versatile portfolio meeting Open Rack v3 (Orv3) standards
- Offers liquid cooling capabilities
- Supports OCP and custom infrastructures
- Global footprint to ensure supply chain resilience
Cabled I/O Connectors
- With twinax copper cables connecting to near-chip connectors
- Supports industry standard form factors like OSFP & QSFP-DD
- Integrated connector and cage press onto the host board
- Advanced thermal management & heat dissipation
Internal Cabled Interconnects
- Flexible, robust, providing optimal signal integrity
- Enable space saving and lowering design costs
- Rated up to 56G PAM-4 (112G) speeds with PCIe Gen 6 & beyond capability
- Various sizing & configuration options
- High-speed solutions to connect devices to the switch
- Greater cable flexibility and longer reach
- Reduced power & latency
- Passive & active, copper & optical options available
- Newly expanded portfolio
- Offer 200G/400G/800G, with 1.6T solutions in development
- Support distances from <100m to 2km
- Reliable performance with great Bit Error Ratio (BER)
- Flexible integration, enabling improved network configuration
- Reliable AC power with board-mount connectors and panel-mount assemblies
- Compliant with ORvX and HPR specifications
- Customizable AC power whips delivering pre-terminated reconfigurable power
- High-current, durable power distribution with engineered vertical busbars
- Versatile cooling options, including air, liquid and immersion
- Supports rack-to-rack power distribution for advanced rack architectures
- Efficient AC-to-DC PSUs including MULTI-BEAM and Card Edge connectors
- Handles power loads using high-current output connectors to the busbar
- Offers custom-engineered cabled and busbar assembly solutions
- Industry-standard creation of ORv3 IT Gear, and adoption as part of the Open Compute Project (OCP)
- Support high-current applications and 12V solutions
- Simplified routing in dense racks with flexible cable exit designs
- High reliability power distribution for compute, server, and networking
- Maximizes space-efficiency and performance with compact, high-density designs
- Comprehensive portfolio of connector types for advanced power solutions
