Industry Tradeshow
OFC 2024
Join us in Booth #1311 to learn more about how TE is helping to empower the AI and ML evolution, from copper to optics.
March 26-28, 2024
San Diego Convention Center
San Diego, CA
Innovative Connectivity Soluitons, from Copper to Optics
TE Connectivity (TE) is driving the future of artificial intelligence (AI) and machine learning (ML) through next generation higher speed, higher density solutions. TE’s robust passive and active electrical and optical connectivity portfolio is helping to optimize the latest data center, edge and telecommunication innovations, delivering speed, scalability, reach, power efficiency, and improved thermal management.
From copper to optics, TE provides cutting-edge solutions to meet today’s processing needs and anticipate tomorrow’s forward-thinking designs.
Featured Products
Active Optical Cable Assemblies
Our active optical cable assembly portfolio provides improved cable flexibility and longer reach, as compared to both traditional passive copper solutions and emerging active copper and active electrical (ACC/AEC) cable solutions, supporting high performance computing, data center and networking interconnect applications.
OTB Connectors & Cable Solutions
Our Over-the-Board (OTB) solutions are designed with optimal data transmission in mind, reducing latency and boosting data transfer speeds, enabling high-performance computing capabilities demanded by AI and ML applications.
OSFP Connectors & Cable Assemblies
TE’s Octal Small Form Factor Pluggable (OSFP) connectors and cable assemblies address next-generation data center needs by supporting aggregate data rates of 200 Gbps and up to 400 Gbps. These products are designed for both 28G NRZ, 56G and 112G PAM-4 protocols.
QSFP-DD Interconnects
QSFP-DD (quad small form-factor pluggable double density) doubles the density of QSFP interconnects with an eight-lane electrical interface capable of 28 Gbps NRZ, 56 Gbps PAM-4 to achieve 200 or 400 Gbps aggregate per port. Our QSFP-DD connector portfolio’s backwards compatibility allows existing QSFP modules to be plugged into QSFP-DD ports.
112G Per Lane I/O Solutions
TE has a wide portfolio of cage designs and mounts to fit various forced air and liquid cooling architectures dissipating 25W+ powers. Offerings include OSFP, QSFP-DD, QSFP, SFP, SFP-DD, and CDFP.
112G External Cabling
Due to the demands on next generation high-speed designs, TE has developed one of the most comprehensive, flexible, and high performing internal and external connector and cable assembly portfolios on the market, with options for DAC, ACC, AEC, and AOC.
Industry Tradeshow
OFC 2024
Join us in Booth #1311 to learn more about how TE is helping to empower the AI and ML evolution, from copper to optics.
March 26-28, 2024
San Diego Convention Center
San Diego, CA
Innovative Connectivity Soluitons, from Copper to Optics
TE Connectivity (TE) is driving the future of artificial intelligence (AI) and machine learning (ML) through next generation higher speed, higher density solutions. TE’s robust passive and active electrical and optical connectivity portfolio is helping to optimize the latest data center, edge and telecommunication innovations, delivering speed, scalability, reach, power efficiency, and improved thermal management.
From copper to optics, TE provides cutting-edge solutions to meet today’s processing needs and anticipate tomorrow’s forward-thinking designs.
Featured Products
Active Optical Cable Assemblies
Our active optical cable assembly portfolio provides improved cable flexibility and longer reach, as compared to both traditional passive copper solutions and emerging active copper and active electrical (ACC/AEC) cable solutions, supporting high performance computing, data center and networking interconnect applications.
OTB Connectors & Cable Solutions
Our Over-the-Board (OTB) solutions are designed with optimal data transmission in mind, reducing latency and boosting data transfer speeds, enabling high-performance computing capabilities demanded by AI and ML applications.
OSFP Connectors & Cable Assemblies
TE’s Octal Small Form Factor Pluggable (OSFP) connectors and cable assemblies address next-generation data center needs by supporting aggregate data rates of 200 Gbps and up to 400 Gbps. These products are designed for both 28G NRZ, 56G and 112G PAM-4 protocols.
QSFP-DD Interconnects
QSFP-DD (quad small form-factor pluggable double density) doubles the density of QSFP interconnects with an eight-lane electrical interface capable of 28 Gbps NRZ, 56 Gbps PAM-4 to achieve 200 or 400 Gbps aggregate per port. Our QSFP-DD connector portfolio’s backwards compatibility allows existing QSFP modules to be plugged into QSFP-DD ports.
112G Per Lane I/O Solutions
TE has a wide portfolio of cage designs and mounts to fit various forced air and liquid cooling architectures dissipating 25W+ powers. Offerings include OSFP, QSFP-DD, QSFP, SFP, SFP-DD, and CDFP.
112G External Cabling
Due to the demands on next generation high-speed designs, TE has developed one of the most comprehensive, flexible, and high performing internal and external connector and cable assembly portfolios on the market, with options for DAC, ACC, AEC, and AOC.
