Ultra Low-Profile. Ultra High Speed.

TE’s Ultra Low-Profile (ULP) PCIe Gen 7 products deliver cutting-edge PCIe Gen 7 electrical performance and with an ultra low-profile mating height to support next generation datacenter and artifical intelligence (AI) applications. This innovative design not only delivers cutting-edge speed data rates of 128 GT/s but also can fit into tight spaces, such as beside a CEM connector slot, under heatsinks, or near chips. The centrally located sidebands ensure superior signal integrity and improved host board routability, enhancing the manufacturability and overall performance of your system.

Target Applications

  • Data Center
  • AI / Machine Learning (ML)
 
  • Server
  • Storage

 

Key Features

  • PCIe Gen 7 Electrical Performance: Our products are fully capable of delivering the high-speed data transmission promised by PCIe Gen 7, with a transmission speed of 128 GT/s PAM4 using the PCIe protocol.
 
  • Ultra Low-Profile: With a mating height less than 9mm, this product can fit into tight spaces that were previously inaccessible, such as beside a CEM connector slot, under heatsinks, or near chips.
 
  • Central Sideband: The centrally located sidebands accommodate PCIe transmission, ensuring optimal signal integrity and performance.
 
  • Platform Product: This is a versatile platform product that covers for the primary use cases of PCIe, including X4/X8/X16 configurations and various applications such as Right Angle, Straight, and Lateral.

PCIe7

Ecosystem Interoperability

128

Gbps Data Rate

Sample

Offering Now

Key Benefits

  • Faster Data Rates with Smaller Form Factor
 
  • Enhanced Usability in Dense Applications
 
  • Superior Host Board Routability
 
  • Full Portfolio Solution