Empowering AI & Data Center Connectivity For Next-Gen Speed, Efficiency, and Reliability

We are your trusted supplier for artificial intelligence (AI) and data center solutions. Our products are engineered for compatibility, interconnectivity, and support industry standard form factors and performance requirements, helping deliver seamless integration and tailored solutions to address your unique needs.

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AI Is Everywhere — Let's Build What's Next

TE Connectivity collaborates with industry leaders to create adaptive, future-ready systems that meet the power, speed, and thermal challenges of AI at scale.

Connectivity Solutions Empowering the AI Evolution

Learn how TE is helping to empower the AI evolution with our robust portfolio of interconnect solutions.

Trend Paper

The Evolution of Data Centers and the Future of Cooling and Connectivity

This trend paper explores how data centers are evolving to meet increasing power and cooling demands, with a focus on new design approaches and connectivity solutions.

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Product Category

AdrenaLINE 224G Product Portfolio

Consisting of 224G product solutions including near-chip connectors, cabled backplane, cabled I/O connectors, micro LGA socket, and 224G in-house produced cable, TE AdrenaLINE is your all-encompassing solution for next generation operations capable of providing end-to-end connectivity where it is needed the most.

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TE Perspective

Power, Speed, Cooling: The AI Data Center Challenge

Learn how TE is helping data centers scale intelligently – supporting high-speed connectivity, liquid cooling, and modular power architectures – to meet the evolving demands of AI training and deployment.

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AI Data Center Portfolio

To support your need to move massive amounts of data among multiple components quickly and reliably, TE produces a variety of connectors designed with the right features as well as a family of internal cable assemblies, while balancing performance, cost, reliability and durability.

Connectivity Solutions for AI Data Centers

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Power Infrastructure Solutions

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Our product portfolio

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Latest Insights and Innovations

Trend Paper

The Evolution of Data Centers and the Future of Cooling and Connectivity

This trend paper explores how data centers are evolving to meet increasing power and cooling demands, with a focus on new design approaches and connectivity solutions.

Read Now
FEATURED APPLICATION

Open Compute Project (OCP) Power Distribution Solutions

TE’s OCP power solutions offering.

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Trend Insight

Accelerating the Deployment of Next-generation AI Infrastructure

At the 2025 Open Compute Project (OCP) Global Summit, TE Vice President of Product Management, Ganesh Srinivasan, spoke with EE Times Editor in Chief, Nitin Dahad, about the rapidly evolving needs of next generation data centers. Watch the interview on EE Times’ YouTube channel now.

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Data Center Power Systems
Trend Insight

Power Systems for Next-Generation Data Centers

Explore how evolving power architectures support high-density AI compute and modern rack-level distribution.

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Trend Insight

Thermal Performance

Today's design challenge includes increasing computing performance in higher-power data racks while managing thermal performance.

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AdrenaLINE Catapult Near Chip
Socket and Mating Connectors
  • High-density, high-speed signal launch from the source
  • Near-chip connector utilizing uLGA socket technology
  • 224G signal integrity performance
  • Customization available
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AdrenaLINE Slingshot
Cabled Backplane Connectors
  • Enables all-to-all communication between AI Chips
  • Hermaphroditic mating interface for 224G performance
  • Operates at 224G PAM-4 data rates with 92 Ohm impedance
  • Mating force required including 1.0 N/DP, with a durability of 200 cycles
  • Optimized for 26 to 32 AWG cabled backplane architectures
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Power Connectors, Cables & Busbar
  • Reliable, scalable & customizable end-to-end power solution
  • Highly versatile portfolio meeting Open Rack v3 (Orv3) standards
  • Offers liquid cooling capabilities
  • Supports OCP and custom infrastructures
  • Global footprint to ensure supply chain resilience
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AdrenaLINE Fastlane
Cabled I/O Connectors
  • With twinax copper cables connecting to near-chip connectors
  • Supports industry standard form factors like OSFP & QSFP-DD
  • Integrated connector and cage press onto the host board
  • Advanced thermal management & heat dissipation
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Sliver PCIe Gen 5/6/7
Internal Cabled Interconnects
  • Flexible, robust, providing optimal signal integrity
  • Enable space saving and lowering design costs
  • Rated up to 56G PAM-4 (112G) speeds with PCIe Gen 6 & beyond capability
  • Various sizing & configuration options
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High-Speed Cable Assemblies
  • High-speed solutions to connect devices to the switch
  • Greater cable flexibility and longer reach
  • Reduced power & latency
  • Passive & active, copper & optical options available
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Optical Transceivers
  • Newly expanded portfolio
  • Offer 200G/400G/800G, with 1.6T solutions in development
  • Support distances from <100m to 2km
  • Reliable performance with great Bit Error Ratio (BER)
  • Flexible integration, enabling improved network configuration
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AC Power InputEfficiently delivering AC from the power source to the rack
  • Reliable AC power with board-mount connectors and panel-mount assemblies
  • Compliant with ORvX and HPR specifications
  • Customizable AC power whips delivering pre-terminated reconfigurable power
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Rack Power DistributionDistributes DC power throughout the rack
  • High-current, durable power distribution with engineered vertical busbars
  • Versatile cooling options, including air, liquid and immersion
  • Supports rack-to-rack power distribution for advanced rack architectures
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Power ShelfSeamlessly converts incoming AC power to DC
  • Efficient AC-to-DC PSUs including MULTI-BEAM and Card Edge connectors
  • Handles power loads using high-current output connectors to the busbar
  • Offers custom-engineered cabled and busbar assembly solutions
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IT Gear DC Input Power Comprehensive cable-connector assemblies deliver power to IT Gear
  • Industry-standard creation of ORv3 IT Gear, and adoption as part of the Open Compute Project (OCP)
  • Support high-current applications and 12V solutions
  • Simplified routing in dense racks with flexible cable exit designs
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Internal Power Distribution Complete power distribution solutions across the entire rack
  • High reliability power distribution for compute, server, and networking
  • Maximizes space-efficiency and performance with compact, high-density designs
  • Comprehensive portfolio of connector types for advanced power solutions
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