AdrenaLINE Catapult UHD 448G CPC Demo
See how TE's co-packaged copper (CPC) solution enables ultra-high-speed connectivity with PAM6 signaling, high-density integration, and real-time signal integrity performance.
Application
448G Is More Than a Speed Upgrade.
It Is Reshaping How AI Data Centers Are Connected, Powered, and Cooled
Artificial intelligence (AI), high-performance computing (HPC), and hyperscale cloud environments are driving data volumes to unprecedented levels. As GPU clusters and distributed inference engines multiply, the limitations of today’s 224 Gbps infrastructure are clear. The next milestone—448 Gbps per lane—will reshape how data centers are built, cooled, and interconnected.This evolution is about more than speed. It’s about density, power efficiency, and scalability across the entire signal chain.
A New Benchmark: OIF's 448G Framework
New Industry Benchmark
TE’s Ecosystem Participation
DesignCon 2026 Best Paper Award
In partnership with Semtech TE engineers present system-level analysis of CPC, DAC, and active copper architectures-highlighting the signal integrity, modulation, and scaling strategies required for 448G data center infrastructure.
Design Challenges at 448G
TE Solutions Enabling the Transition
From high-speed interconnects to advanced power and thermal solutions, TE enables the speed, density, and efficiency required for next-generation 448G AI infrastructure.
Liquid-Cooled Busbar and I/O Demo
Explore how TE's liquid-cooled busbar and I/O solutions help address thermal challenges and deliver reliable power for AI infrastructure at scale.
High-Speed I/O
TE is advancing next-generation high-speed I/O solutions designed to support emerging 448G architectures, with a focus on signal integrity, thermal compatibility, density and scalable form factors.
Backplane Solutions
Active and passive backplane solutions engineered for 448G signaling, combining retimer / redriver integration and resonance-free design for extended reach and simplified serviceability.
External Cable Assemblies
A complete range of Direct Attach Copper (DAC), Active Copper Cable (ACC), Active Electrical Cable (AEC), and Active Optical Cable (AOC) interconnects supports 448G-ready architectures across short to mid-reach channels.
Power Delivery Solutions
As system power scales beyond 1 MW per rack, TE’s high-efficiency connectors, cables, and busbars ensure reliable delivery with minimal conductive and thermal loss—complementing high-speed signaling with optimized power infrastructure.
Our AI Connectivity Solutions
