Industry Tradeshow

OCP GLOBAL SUMMIT 2026

Join TE Connectivity in Booth #D3

October 12-15, 2026

San Jose, California

Engineering the Future of AI

Join TE Connectivity (TE) at OCP Global Summit 2026, booth #D3, to learn more about our broad portfolio of interconnect solutions designed for higher speeds, higher density scalability, and power efficiency in data center architectures. 

Hear From Our Experts

  • Reducing Parasitics, Improving Performance: The Case for Low Inductance Interconnects
  • Co-Packaged Copper at 448G: Balancing Electrical Efficiency with System Level Complexity
  • PANEL: 400G/Lane Optics Module Connectors
  • PANEL: Standards and Future Technologies
  • Cooling the 448G Frontier: Thermal Architecture for 500 W-Class HSIO Using Direct-to-Chip Liquid Cooling
  • Enabling 1MW+ IT rack power with an open rack busbar interface

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Product Solutions for Data Centers

Industries

Connectivity Solutions for Data Center & Artificial Intelligence

We are a trusted supplier for artificial intelligence (AI) and data center solutions, providing comprehensive customer support and tailored solutions to address your unique needs.
OCP Power

Application

OCP Power Distribution Solutions

With TE Connectivity's (TE) plug-and-play power connectors, busbars and cable assembly solutions for Open Compute Project (OCP) architecture , you get a standardized platform for system designs. TE offers numerous power solutions to address many of your special design requirements.

Product Group

AdrenaLINE 224G Product Portfolio

Consisting of 224G product solutions including near-chip connectors, cabled backplane, cabled I/O connectors, and 224G in-house produced cable, TE AdrenaLINE is your all-encompassing solution for next generation operations capable of providing end-to-end connectivity where it is needed the most.

Product Category

High-Speed I/O Cables & Connectors for Data Centers & AI

Unlock the full potential of Artificial Intelligence (AI) with our high-reliability, premium-quality, and ultra-fast I/O cables.

Optical Transceiver

Product Group

Optical Transceiver

Designed for hyperscale data centers, AI/ML, HPC, and telecom applications, our transceivers including 200G, 400G, 800G and 1.6T solutions, deliver reliable performance, flexibility, and scalability.

Product Group

Ultra Low Profile PCIe Gen 7 Connectors

TE Connectivity's Ultra Low-Profile PCIe Gen 7.0 products deliver 128 GT/s data rates with exceptional signal integrity, all within a compact design ideal for high-performance data center and AI systems.
Thermal Bridge Technology for Input/Output (I/O) Applications

Product Group

Thermal Bridge Technology for Input/Output (I/O) Applications

Our innovative thermal bridge technology provides up to 2x better thermal resistance over traditional thermal technologies such as gap pads or thermal pads.

Industry Tradeshow

OCP GLOBAL SUMMIT 2026

Join TE Connectivity in Booth #D3

October 12-15, 2026

San Jose, California

Engineering the Future of AI

Join TE Connectivity (TE) at OCP Global Summit 2026, booth #D3, to learn more about our broad portfolio of interconnect solutions designed for higher speeds, higher density scalability, and power efficiency in data center architectures. 

Hear From Our Experts

  • Reducing Parasitics, Improving Performance: The Case for Low Inductance Interconnects
  • Co-Packaged Copper at 448G: Balancing Electrical Efficiency with System Level Complexity
  • PANEL: 400G/Lane Optics Module Connectors
  • PANEL: Standards and Future Technologies
  • Cooling the 448G Frontier: Thermal Architecture for 500 W-Class HSIO Using Direct-to-Chip Liquid Cooling
  • Enabling 1MW+ IT rack power with an open rack busbar interface

orange bar
Product Solutions for Data Centers

Industries

Connectivity Solutions for Data Center & Artificial Intelligence

We are a trusted supplier for artificial intelligence (AI) and data center solutions, providing comprehensive customer support and tailored solutions to address your unique needs.
OCP Power

Application

OCP Power Distribution Solutions

With TE Connectivity's (TE) plug-and-play power connectors, busbars and cable assembly solutions for Open Compute Project (OCP) architecture , you get a standardized platform for system designs. TE offers numerous power solutions to address many of your special design requirements.

Product Group

AdrenaLINE 224G Product Portfolio

Consisting of 224G product solutions including near-chip connectors, cabled backplane, cabled I/O connectors, and 224G in-house produced cable, TE AdrenaLINE is your all-encompassing solution for next generation operations capable of providing end-to-end connectivity where it is needed the most.

Product Category

High-Speed I/O Cables & Connectors for Data Centers & AI

Unlock the full potential of Artificial Intelligence (AI) with our high-reliability, premium-quality, and ultra-fast I/O cables.

Optical Transceiver

Product Group

Optical Transceiver

Designed for hyperscale data centers, AI/ML, HPC, and telecom applications, our transceivers including 200G, 400G, 800G and 1.6T solutions, deliver reliable performance, flexibility, and scalability.

Product Group

Ultra Low Profile PCIe Gen 7 Connectors

TE Connectivity's Ultra Low-Profile PCIe Gen 7.0 products deliver 128 GT/s data rates with exceptional signal integrity, all within a compact design ideal for high-performance data center and AI systems.
Thermal Bridge Technology for Input/Output (I/O) Applications

Product Group

Thermal Bridge Technology for Input/Output (I/O) Applications

Our innovative thermal bridge technology provides up to 2x better thermal resistance over traditional thermal technologies such as gap pads or thermal pads.