MiniMRP Avionics Packaging

MiniMRP Avionics Packaging

Distributed, Integrated Modular Avionics Packaging - Miniaturized. MiniMRP avionics is the next generation of integrated circuits, putting ever-increasing computing power into 40% smaller packages at lower costs. The ability to interconnect small-form-factor electronic devices, either directly or over a network, enables distributed systems that replace traditional centralized systems. With MiniMRP avionics, the big box in the avionics bay can be replaced with many small boxes distributed throughout the aircraft, helping to meet your SWaP reduction requirements.

Product Features :

MiniMRP Avionics Packaging
  • 40% reduced space
  • Up to 60% weight savings
  • Easy installation and maintenance
  • Flexible modularity and industry standardization
  • Reduced development and qualification cycles
  • DEUTSCH DMC-M Series Connectors are the preferred connector solution for MiniMRP modules.
  • Standardized in European Standard EN4165,
  • DMC-M connectors provide a modular, flexible, and reliable system.
  1. MiniMRP Avionics Packaging

MiniMRP Avionics is the next generation of integrated circuits, putting ever-increasing computing power into 40% smaller packages at lower costs.

Increased Computing Power in a Smaller Package

MiniMRP avionics is the next generation of integrated circuits, putting ever-increasing computing power into 40% smaller packages at lower costs. 

 

Small Form Factor Devices 

The ability to interconnect small-form-factor electronic devices, either directly or over a network, enables distributed systems that replace traditional centralized systems. 

 

Distributed Architecture 

With MiniMRP avionics, the big box in the avionics bay can be replaced with many small boxes distributed throughout the aircraft, helping to meet your SWaP reduction requirements.

 MiniMRP Avionics Packaging Compared to ARINC 600 Legacy System
MiniMRP Avionics Packaging Compared to ARINC 600 Legacy System