Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• Contact Mating Area Plating Material Thickness : 3.81 µm [ 150 µin ]

• Contact Underplating Material Thickness (µm): 1.27, 2.54

• Contact Underplating Material Thickness (µin): 50, 100

• PCB Contact Termination Area Plating Material Thickness : 3.81 µm [ 150 µin ]

• PCB Terminal Type : Tab

• Mating Tab Width : 4.75 mm [ .187 in ]

• Mating Tab Thickness : .81 mm [ .032 in ]

• Terminal Plating Material : Tin

• Contact Underplating Material : Nickel

• Terminal Size : 4.75

• Terminal Orientation : Straight

• Termination Method to Printed Circuit Board : Through Hole - Solder

• Product Terminates To : Printed Circuit Board

• Wire Insulation Support : Without

• PCB Thickness (Recommended) : 1.57 mm [ .062 in ]

• PCB Hole Diameter : 1.4 mm [ .055 in ]

• Profile Height from PCB : 14.22 mm [ .567 in ]

• Extension Below Board : 3.81 mm [ .15 in ]

• Insulation Option : Uninsulated

• Operating Temperature Range : -40 – 105 °C [ -40 – 221 °F ]

• Packaging Quantity : 10000

• Packaging Method : Reel