Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• Contact Mating Area Plating Material Thickness : 2.54 – 5.08 µm [ 100 – 200 µin ]

• Contact Underplating Material Thickness : 2.54 µm [ 100 µin ]

• PCB Contact Termination Area Plating Material Thickness : 2.54 – 5.08 µm [ 100 – 200 µin ]

• PCB Terminal Type : Tab

• Mating Tab Width : 2.79 mm [ .11 in ]

• Mating Tab Thickness : .8 mm [ .032 in ]

• Terminal Plating Material : Tin

• Contact Underplating Material : Nickel

• Terminal Orientation : Right Angle

• Termination Method to Printed Circuit Board : Through Hole - Solder

• Product Terminates To : Printed Circuit Board

• Wire Insulation Support : Without

• PCB Thickness (Recommended) : 3.18 mm [ .125 in ]

• PCB Hole Diameter : 1.4 mm [ .055 in ]

• Profile Height from PCB : 4.67 mm [ .184 in ]

• Extension Below Board : 3.81 mm [ .15 in ]

• Insulation Option : Uninsulated

• Operating Temperature Range : -40 – 105 °C [ -40 – 221 °F ]