Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• Contact Mating Area Plating Material Thickness : 3.81 µm [ 150 µin ]

• Contact Underplating Material Thickness (µm): 1.27, 2.54

• Contact Underplating Material Thickness (µin): 50, 100

• PCB Contact Termination Area Plating Material Thickness : 3.81 µm [ 150 µin ]

• PCB Terminal Type : Tab

• Mating Tab Width : 4.75 mm [ .187 in ]

• Mating Tab Thickness : .51 mm [ .02 in ]

• Terminal Plating Material : Tin

• Contact Underplating Material : Brass

• Terminal Orientation : Straight

• Termination Method to Printed Circuit Board : Through Hole - Solder

• Product Terminates To : Printed Circuit Board

• Wire Insulation Support : With

• Terminal Material Thickness : .51 mm [ .02 in ]

• PCB Thickness (Recommended) : 1.57 mm [ .062 in ]

• PCB Hole Diameter : 1.32 mm [ .052 in ]

• Profile Height from PCB : 8.63 mm [ .344 in ]

• Extension Below Board : 3.81 mm [ .15 in ]

• Insulation Option : Uninsulated

• Operating Temperature Range : -30 – 110 °C [ -22 – 230 °F ]

• Packaging Quantity : 1000

• Packaging Method : Package