Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• Ground Component Type : Ground Return Shielding

• PCB Connector Assembly Type : PCB Mount Header

• Connector System : Board-to-Board

• Sealable : No

• Connector & Contact Terminates To : Printed Circuit Board

• Backplane Interface Type : 2mm HM

• Rows Loaded : A, B, C, D, E, F, Z

• Number of Columns : 22

• Number of Rows : 7

• Backplane Architecture : Mezzanine

• Number of Positions : 154

• PCB Mount Orientation : Vertical

• Data Rate (Gb/s): ≤1

• Crosstalk Version : Standard

• Contact Base Material : Phosphor Bronze

• PCB Contact Termination Area Plating Material : Tin-Lead

• Contact Underplating Material : Nickel

• Contact Type : Pin

• CompactPCI Designation : None

• Contact Mating Area Plating Material : Gold

• Contact Mating Area Plating Material Thickness : .76 µm [ 30 µin ]

• Contact Current Rating (Max) (A): 1.5

• Feedthrough Post Length (mm): 3.7

• Contact Mating Area Length (mm): 13.45

• Termination Method to Printed Circuit Board : Through Hole - Press-Fit

• Mating Alignment Type : Multi-Purpose Center

• Connector Mounting Type : Board Mount

• Front Mating Level : Level 1

• Housing Material : Polyester - GF

• Centerline (Pitch) : 2 mm [ .078 in ]

• Housing Color : Gray

• Backplane Module Length (mm): 50

• Operating Temperature Range : -55 – 125 °C [ -67 – 257 °F ]

• Shielded : Yes

• Circuit Application : Power & Signal

• UL Flammability Rating : UL 94V-0

• AdvancedTCA Specified Product : No