TE News: TE adds high-temperature headers to BUCHANAN PCB Connector

TE Connectivity adds high-temperature headers to BUCHANAN PCB Connector portfolio


September 24, 2019

Media Inquiries

Jonathan Graham

Email - jonathan.graham@te.com

Tel -  +49-6151 607 3756


September 24, 2019

TE Connectivity (TE), a world leader in connectivity and sensors, is augmenting its BUCHANAN PCB Connector portfolio with headers that have housings in very high-temperature-resistant thermoplastic.


The new headers conform to the IPC/JEDEC-J-STD-020D moisture/reflow sensitivity classification, with an MSL (Moisture Sensitivity Level) rating of 1. As a result, the connectors can be used in automated through-hole lead-free reflow soldering processes without risk of blistering. In addition, the low water absorption of the thermoplastic enables part dimensions to stay within tight dimensional tolerances.


“The engineers at TE have designed the new headers for use in control system applications to suit high density, signal and power applications,” says TE Product Manager Christian Netsch. “We expect them to be used in such products as servo/ inverter drives, PLCs, safety controls/modules, power supply units and HVAC systems.”


The straight and right angle shrouded male headers have a pitch of 3.5 or 3.81 mm (0.2 in), in versions with between two and 24 poles.


“Customers using the new headers can save on their assembly operations, since everything can be soldered in a single step,” Netsch notes. “The glass fiber-reinforced housing material is resistant to temperatures of at least 260°C, and it also has a high CTI (Comparative Tracking Index) insulation rating of over 600 V. It has a UL94 V-0 flammability rating as well. Furthermore, the MSL1 rating means there is no need to store the headers in special storage conditions to keep them dry ahead of the soldering process.”


The headers can be handled with pick-and-place robots with vacuum nozzles or mechanical pliers. Packaging in tape and reel is available on request for all pole sizes, to enable auto-fed PCB assembly. An extra feature is the pick-up-cap-less design, which saves waste and cap removal time after the soldering process.


For more information, go to www.te.com/usa-en/products/brands/buchanan.html?tab=pgp-story.


TE Connectivity

Pfnorstrasse 1

64293 Darmstadt


+49 6154 607 1740


About TE

TE Connectivity Ltd. (NYSE: TEL) is a $14 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS.

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