Featured Product: Mezalok HSLF

Mezalok HSLF

TE Connectivity’s Mezalok connector delivers high speed with low force

The HSLF XMC connector delivers 32+ Gb/s with a lower extraction force.

September 09, 2021

TE Connectivity (TE), a world leader in connectivity and sensors, introduces its Mezalok High-Speed Low-Force (HSLF) XMC connector to support data rate speeds up to 32+ Gb/s for improved signal processing on embedded computing applications. The enhanced HSLF Mezalok connector joins TE’s family of rugged, highly reliable connectors designed to meet the growing demand for higher data rates. Designed specifically for mezzanine applications, the connector meets legacy Mezalok high speed connector qualifications and uses a rugged dual point contact system.
 

Fast, refined, rugged, upgradeable and flexible, Mezalok HSLF XMC connectors meet the same rugged standards as VITA 47 and VITA 72. Suited best for aerospace, ground vehicle, marine and missile defense applications, these HSLF connectors feature a wide operating temperature range and excellent thermal stability with VITA 42.3 pinout.
 

“Technology changes rapidly and it’s always important for us to quickly adapt and solve for market needs. We know signal integrity strength is crucial for reliable high-speed signal transfer within the environments this type of connector is used,” said Jason Dorwart, product manager for TE’s Aerospace, Defense and Marine division. “We also designed this particular connector to be easier to remove from the board and are truly excited to continue on with our Mezalok connector legacy by introducing our low-force product offering.”
 

The highly reliable Mezalok HSLF uses the reliable ball grid array printed circuit board surface mount. The 114-position connector is compliant to VITA 61 standards and additional positions and stack heights are available.
 

TE’s Mezalok HSLF connector family offers:

● Unmating force reduction of 47%

● Mating force reduction of 32%

● Rugged dual-point contact system
 

For product configurations, TE features:

● Multiple positions - 60, 114 and 320

● Multiple stack heights - 10,12,17 and 18 mm 

● Ball grid array PCB supports standard surface mount processing

 

About TE

TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive and connected future. Our broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications and the home. With approximately 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.

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