FLIP-N-LOK Connector for Space-Saving PCB Design
TE Connectivity (TE) introduces a high-density wire-to-board solution designed to optimize PCB space and enhance overall assembly efficiency and ergonomics. The new FLIP-N-LOK connector is a high-density, multi-load solution that can help replace multiple signal headers with a single high-density header—freeing up board space, enabling a cleaner layout, and reducing assembly takt times. Its innovative lever design improves ergonomics by reducing mating force and also functions as a secure locking mechanism. To help prevent incorrect terminal insertion, the housing features built-in error-proofing elements.
Product Features
| Centerline (mm) | 2.5 | Operating Temperature (°C) | -30 to +105 |
| Maximum Current Rating (A) | 2.8 | Wire Size (AWG) | 22-24 |
| Voltage Rating | 50 VDC | Positions Available | 2-20 |
| IEC 60335-1 Glow-Wire Available | No | Sealed Version Available | No |
| UL94 Rating Available | V-0 | Color/Keying Available | Yes |
| Agency Approvals | UL | Available Configurations | Wire-to-Board |
