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Overview

Miniaturized Automotive I/O Connectors

A vehicle’s weight can be reduced by using lighter or less material, improving fuel efficiency and reducing C02 emissions. TE’s NanoMQS and MCON  0.50 terminal and connector systems only require about half of the packaging space versus 0.63 mm2 systems. The headers are designed to withstand harsh environments such as high vibrations due to their low mass and contact force.

Circuits Sealed Orientation Tab Width Hybrid Termination Method
6-32 No 90° | 180° 0.50 mm No Solder | SMT
Features

Please review product documents or contact us for the latest agency approval information.  

Product Type Features

  • Header Type  Fully Shrouded

  • Connector Product Type  Connector Assembly

  • Mixed & Hybrid Header  No

  • Connector Shape  Rectangular

  • Sealable  No

  • Connector System  Wire-to-Board

  • Connector & Contact Terminates To  Printed Circuit Board

Configuration Features

  • Number of Signal Positions  24

  • PCB Mount Orientation  Horizontal

  • Number of Positions  24

  • Number of Rows  2

Electrical Characteristics

  • Operating Voltage (VDC) 12

  • Nominal Voltage Architecture (V) 12

  • Voltage Rating (Max) (VDC) 12

Body Features

  • Primary Product Color  Black

Contact Features

  • Contact Type  Tab

  • Mating Tab Width  .5 mm [ .02 in ]

  • Mating Tab Thickness  .4 mm [ .016 in ]

  • Contact Mating Area Plating Material  Tin (Sn)

Termination Features

  • Termination Method to PCB  Surface Mount

Mechanical Attachment

  • PCB Mount Retention Type  Solder Peg

  • PCB Mount Alignment  Without

  • Mating Alignment  With

  • PCB Mount Retention  Without

  • Panel Mount Feature  Without

  • Mounting Holes  With | Without

  • Mating Retention Type  Locking Interface

  • Connector Mounting Type  Board Mount

Housing Features

  • Centerline (Pitch) (mm) 1.6 | 2

  • Centerline (Pitch) (in) .06 | .07

Dimensions

  • Connector Length (mm) 37.9

  • Connector Length (in) 1.49 | 1.5

  • Connector Width (mm) 19

  • Connector Width (in) .74 | .748

  • Profile Height from PCB  7.9 mm [ .311 in ]

Usage Conditions

  • Operating Temperature (Max) (°C) 65 | 70 | 75 | 80 | 85

  • Operating Temperature (Max) (°F) 149 | 158 | 167 | 176 | 185

  • Operating Temperature Range  -30 – 85 °C [ -22 – 185 °F ]

Operation/Application

  • Solder Process  Reflow Solder Capable

  • Shielded  No

  • Circuit Application  Signal

Packaging Features

  • Packaging Method  Tray | Tube

  • Packaging Quantity  36

Other

  • Interface Number  2013031

Related Materials

Datasheets & Catalog Pages