This product is not currently available. For more information, including distributor inventory, please contact us.

  • Product Listing

This product is not currently available. For more information, including distributor inventory, please contact us.

LGA 2011 Sockets

LGA 2011 Sockets-CAT-L59017-A68
LGA 2011 Sockets were designed for use with Intel's Core i7 and Xeon 5 LGA 2011 (Sandy Bridge) CPU processors. They are available with Gold 15 or Gold 30 contact plating. LGA 2011 Socket applications include servers and high end desktops.
More Less

Product Features

  • IC Socket Type : LGA 2011

  • Contact Mating Area Plating Material Thickness (µin): 15, 30

  • Number of Positions : 2011

  • Centerline (Pitch) : 1.02 mm [ .04 in ]

  • Termination Method to PCB : Surface Mount - Solder Ball

Available from

LADD Inc

Build and price the product now

Overview

Product Features

LGA Sockets

  • Socket housing facilitates efficient soldering to the PCB
  • Socket is supplied with a cap to facilitate vacuum pick and place
  • Backplates are available in zinc or nickel plating
Datasheet
LGA 3647 Socket Datasheet (English)
Datasheet
XLA Socket Datasheet (English)

Select Applications

LGA Sockets

  • Servers
  • High Performance Computing (HPC)
  • Workstations and desktop computers

Product Group

ChipConnect Cable Assemblies

ChipConnect internal faceplate-to-processor cable assemblies enable Intel Omni-Path Architecture (OPA) by mating directly with LGA 3647 sockets at the processor and QSFP28 port at the faceplate for 25 Gbps speeds.

Product Category

Sockets

Our sockets and hardware support next-generation CPUs for higher performance and scaling.

Application

Server Solutions

Extend a server’s reach and reduce its power consumption, while increasing speed and density in any configuration – blade, rack mount, or sleds.
Features

Please review product documents or contact us for the latest agency approval information.  

Product Type Features

  • Connector System  Board-to-Board

  • Connector & Contact Terminates To  Printed Circuit Board

Configuration Features

  • Number of Positions  2011

  • Grid Spacing  1.016 x .8814 mm [ .040 x .0347 in ]

Body Features

  • Frame Style  Square

Contact Features

  • Contact Mating Area Plating Material  Gold (Au)

  • Contact Base Material  Copper Alloy

  • IC Socket Type  LGA 2011

  • Contact Mating Area Plating Material Thickness (µin) 15, 30

  • Contact Current Rating (Max) (A) .5

Termination Features

  • Termination Method to PCB  Surface Mount - Solder Ball

Mechanical Attachment

  • Connector Mounting Type  Board Mount

Housing Features

  • Housing Color  Black

  • Housing Material  High Temperature Thermoplastic

  • Centerline (Pitch)  1.02 mm [ .04 in ]

Operation/Application

  • Circuit Application  Signal

Industry Standards

  • UL Flammability Rating  UL 94V-0

Packaging Features

  • Packaging Method  Tray

  • Tray Color  Black, Blue

Reference Number

  • TE Internal Number CAT-L59017-A68

Related Materials
No documentation available.