DDR3 SO DIMM Sockets

Please review product documents or contact us for the latest agency approval information.  

• Connector System  Cable-to-Board

• Connector & Contact Terminates To  Printed Circuit Board

• DRAM Type  Double Data Rate (DDR) 2 | Double Data Rate (DDR) 3 | Small Outline (SO)

• Number of Keys  1

• Number of Bays  2

• Number of Rows  2

• Module Orientation  Right Angle

• Number of Positions  144

• DRAM Voltage (V) 1.8 | 3.3

• SGRAM Voltage (V) 1.8 | 3.3

• Latch Plating Material  Tin

• Latch Material  Stainless Steel

• Ejector Type  Locking

• Ejector Location  Both Ends | None

• Module Key Type  DRAM | SDRAM | SGRAM

• Connector Profile  High | Low | Standard

• Memory Socket Type  Memory Card

• Contact Base Material  Copper Alloy | Phosphor Bronze

• PCB Contact Termination Area Plating Material  Gold | Gold Flash | Tin

• Contact Mating Area Plating Material  Gold (Au)

• Contact Mating Area Plating Material Thickness (µm) .25 | .76

• Contact Mating Area Plating Material Thickness (µin) 9.84 | 30

• Termination Method to PCB  Surface Mount

• Insertion Style  Cam-In

• PCB Mount Retention Type  Hold-Down Post | Solder Tail

• PCB Mount Retention  With

• Mating Alignment Type  Offset Left | Standard Keying

• Connector Mounting Type  Board Mount

• Housing Material  High Temperature Plastic | High Temperature Thermoplastic

• Housing Color  Black | Natural

• Centerline (Pitch)  .8 mm [ .031 in ]

• Stack Height (mm) 4 | 5.2 | 5.6 | 9.9

• Stack Height (in) .157 | .205 | .22 | .389

• Row-to-Row Spacing (mm) 5.4 | 6.2

• Row-to-Row Spacing (in) .21 | .244

• Operating Temperature Range  -55 – 105 °C [ -67 – 221 °F ]

• Circuit Application  Signal

• UL Flammability Rating  UL 94V-0

• Packaging Quantity  12 | 20 | 200 | 240 | 270

• Packaging Method  Box | Reel | Tape & Reel | Tray