AMPMODU System 50

Please review product documents or contact us for the latest agency approval information.  

• PCB Connector Type  PCB Mount Header | PCB Mount Receptacle

• PCB Connector Type  PCB Mount Header | PCB Mount Receptacle

• Connector System  Board-to-Board | Wire-to-Board

• Header Type  Fully Shrouded | Unshrouded

• Sealable  No

• Connector & Contact Terminates To  Printed Circuit Board

• Header Type  Fully Shrouded | Unshrouded

• Connector Product Type  Connector Assembly

• Stackable  Yes

• Connector Contact Load Condition  Fully Loaded

• PCB Mount Orientation  Right Angle | Vertical

• PCB Mount Orientation  Right Angle | Vertical

• Number of Positions  4 | 5 | 6 | 8 | 10 | 12 | 14 | 15 | 16 | 17 | 20 | 22 | 24 | 25 | 26 | 30 | 34 | 36 | 40 | 50 | 60 | 68 | 72 | 80 | 100

• Number of Rows  1 | 2

• Board-to-Board Configuration  Mezzanine (Stacking) | Perpendicular

• Number of Rows  1 | 2

• Insulation Resistance (Min) (MΩ) 5000

• Dielectric Withstanding Voltage (Max) (V) 500

• Dielectric Withstanding Voltage (Max) (VAC) 500

• Operating Voltage (VAC) 30

• Operating Voltage (VAC) 30

• PCB Retention Feature Plating Material  Tin | Tin over Nickel

• Connector Profile  Standard

• PCB Retention Feature Material  Copper Alloy

• Primary Product Color  Black

• Primary Product Color  Black

• PCB Contact Termination Area Plating Material Thickness (µm) 3.81 – 6.35 | 3.81

• PCB Contact Termination Area Plating Material Thickness (µin) 150 | 150 – 250

• PCB Contact Termination Area Plating Material Finish  Matte

• Mating Square Post Dimension (mm) .38 | .64

• Mating Square Post Dimension (in) .015 | .025

• Contact Base Material  Copper Alloy | Phosphor Bronze

• PCB Contact Termination Area Plating Material  Tin

• Contact Underplating Material  Nickel

• Contact Layout  Matrix

• Contact Shape & Form  Rectangular | Round

• Contact Underplating Material Thickness  1.27 µm [ 50 µin ]

• PCB Contact Termination Area Plating Material  Tin

• Contact Mating Area Plating Material Thickness (µm) .03 | .381 | .76 | .762 | 3.81

• Contact Mating Area Plating Material Thickness (µin) 1.18 | 15 | 30 | 150

• Contact Mating Area Plating Material Finish  Bright

• Contact Mating Area Plating Material  Gold (Au) | Tin (Sn)

• Contact Type  Pin | Receptacle | Socket

• Contact Mating Area Plating Material Thickness (µm) .03 | .381 | .76 | .762 | 3.81

• Contact Mating Area Plating Material Thickness (µin) 1.18 | 15 | 30 | 150

• Contact Mating Area Plating Material  Gold (Au) | Tin (Sn)

• Contact Current Rating (Max) (A) 1 | 3 | 3.6

• Contact Type  Pin | Receptacle | Socket

• Rectangular Termination Post & Tail Width  .2 mm [ .008 in ]

• Rectangular Termination Post & Tail Thickness (mm) .38 | .4 | 3 | 3.6

• Rectangular Termination Post & Tail Thickness (in) .015 | .016 | .118 | .142

• Termination Post & Tail Length (mm) .8 | 2.54 | 3.45 | 3.68

• Termination Post & Tail Length (in) .031 | .1 | .136 | .145

• Termination Post & Tail Diameter  .38 mm [ .015 in ]

• Termination Method to PCB  Surface Mount | Through Hole - Solder

• Termination Method to PCB  Surface Mount | Through Hole - Solder

• PCB Mount Retention Type  Boardlock | Hold-Down Post

• Mating Retention  With

• Panel Mount Feature  With | Without

• Mating Retention Type  Latching Feature

• Mating Retention  With

• PCB Mount Alignment  With | Without

• Mating Alignment Type  Card Edge Slot | Latch | Polarization

• PCB Mount Alignment  With | Without

• Connector Mounting Type  Board Mount

• Mating Alignment  With | Without

• PCB Mount Retention  With | Without

• PCB Mount Retention  With | Without

• Centerline (Pitch)  1.27 mm [ .05 in ]

• Housing Material  Liquid Crystal Polymer (LCP) | Polyphthalamide (PPA) | Thermoplastic

• Housing Material  Liquid Crystal Polymer (LCP) | Polyphthalamide (PPA) | Thermoplastic

• Connector Length (mm) 7.47 | 13.82 | 16.36 | 20.17 | 26.52 | 32.87 | 39.22 | 44.3 | 51.92 | 64.62 | 64.64

• Connector Length (in) .294 | .544 | .64 | .794 | 1.044 | 1.294 | 1.544 | 1.744 | 2.04 | 2.54

• Connector Height (mm) 5.51 | 8.89 | 9.4

• Connector Height (in) .217 | .35 | .37

• Connector Width (mm) 5.03 | 11.1

• Connector Width (in) .198 | .437

• Row-to-Row Spacing  2.54 mm [ .1 in ]

• Stack Height (mm) 11.43 | 13.08

• Stack Height (in) .45 | .514

• PCB Thickness (Recommended)  1.57 mm [ .062 in ]

• Housing Temperature Rating  High | Standard

• Operating Temperature (Max)  105 °C [ 221 °F ]

• Operating Temperature Range  -65 – 105 °C [ -85 – 221 °F ]

• Solder Process Feature  Board Standoff

• Circuit Application  Power & Signal | Signal

• Compatible With Approved Standards Products  CSA LR7189 | UL E28476

• UL Rating  Recognized

• Compatible With Agency/Standards Products  CSA | UL

• UL Flammability Rating  UL 94V-0

• UL Flammability Rating  UL 94V-0