TE Connectivity (TE)
TE Connectivity (TE)
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This product is not currently available. For more information, including distributor inventory, please contact us.
- TE Internal #: 2013311-1
- TE Internal Description: SEMI-HARD TRAY DDR3 204P 9.2H RVS
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DRAM Type : Double Data Rate (DDR) 3
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Stack Height : 9.2 mm [ .362 in ]
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Module Orientation : Right Angle
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Number of Positions : 204
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Centerline (Pitch) : .6 mm [ .024 in ]
Documents
CAD Files
- 3D PDF 3D_CVM_CVM_2013311-1_C.pdf 3D
- Customer View Model ENG_CVM_CVM_2013311-1_C.2d_dxf.zip English
- ENG_CVM_CVM_2013311-1_C.3d_igs.zip English
- ENG_CVM_CVM_2013311-1_C.3d_stp.zip English
Product Specifications
- Product Specification ENG_SS_108-78493_B.pdf English
Product Change Notification
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Features
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Product Features & Characteristics
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Product Type Features
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Connector & Contact Terminates To : Printed Circuit Board
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DRAM Type : Double Data Rate (DDR) 3
Configuration Features
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Number of Rows : 2
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Number of Keys : 1
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Number of Bays : 2
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Module Orientation : Right Angle
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Number of Positions : 204
Electrical Characteristics
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DRAM Voltage (V): 1.5
Signal Characteristics
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SGRAM Voltage (V): 1.5
Body Features
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Ejector Location : Both Ends
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Ejector Type : Locking
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Module Key Type : SGRAM
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Latch Material : Stainless Steel
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Latch Plating Material : Tin
Contact Features
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PCB Contact Termination Area Plating Material : Gold
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Contact Base Material : Copper Alloy
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Memory Socket Type : Memory Card
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Contact Mating Area Plating Material : Gold Flash
Termination Features
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Termination Method to PCB : Surface Mount
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Insertion Style : Cam-In
Mechanical Attachment
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PCB Mount Retention : With
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Mating Alignment Type : Reverse Keying
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PCB Mount Retention Type : Solder Peg
Housing Features
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Housing Material : High Temperature Thermoplastic
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Housing Color : Black
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Centerline (Pitch) : .6 mm [ .024 in ]
Dimensions
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Stack Height : 9.2 mm [ .362 in ]
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Row-to-Row Spacing : 8.2 mm [ .322 in ]
Industry Standards
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UL Flammability Rating : UL 94V-0
Packaging Features
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Packaging Quantity : 20
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Packaging Method : Semi-Hard Tray Assembly
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