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Electrical Characteristics
Contact Features
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Contact Mating Area Plating Material Thickness :
.51 µm [ 20 µin ]
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PCB Contact Termination Area Plating Material :
Tin
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Contact Base Material :
Copper Alloy
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Memory Socket Type :
Memory Card
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Contact Mating Area Plating Material :
Gold (Au)
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Socket Style :
DIMM
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PCB Contact Termination Area Plating Material Thickness :
2.54 µm [ 100 µin ]
Mechanical Attachment
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PCB Mount Retention :
With
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Mating Alignment :
Without
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Mating Alignment Type :
Offset Left
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PCB Mount Retention Type :
Solder Peg
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Mount Angle :
Right Angle
Industry Standards
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UL Flammability Rating :
UL 94V-0
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