TE News: Powering next generation AI data centers at COMPUTEX 2026

TE Connectivity will highlight its latest power, thermal and optical solutions enabling AI architectures.

Published

05/27/26

Media Inquiries

John Lindsey

TE Connectivity

Tel: +1 (717) 315-9422

Email: john.b.lindsey@te.com

June 1, 2026

TAIPEI, Taiwan

TE Connectivity, a world leader in connectivity and sensors, is helping empower the evolution of artificial intelligence and machine learning through a robust portfolio of connectivity solutions engineered for next-generation infrastructure. At COMPUTEX 2026 in Taipei, Taiwan, TE will engage with customers and partners, highlighting innovations in high-speed, high-density connectivity, power and cooling and optical solutions to demonstrate how it is helping enable customers to build the future of AI.

 

“AI workloads are driving increasing demands on data center infrastructure—most critically in speed, density, power efficiency, and scalability,” said Vishwas Rao, TE senior vice president and general manager. “TE is advancing end-to-end connectivity solutions and collaborating across the ecosystem to support the next generation of AI infrastructure.”

 

Redefining Data Center Power and Sustainability with HVDC
Industry momentum is shifting from traditional 12V/48V architectures toward 800V architectures with an increased need for power distribution efficiency and power density in AI data centers.

TE is helping empower this transition with end-to-end high-voltage direct current (HVDC) power solutions. From connectors and cables to busbar systems, TE’s portfolio helps reduce power loss, optimize thermal performance, and enable efficient power delivery from AC input to IT load.

 

Advancing High-Density Power with Liquid Cooling Solutions
Increasing rack power densities are making advanced thermal management a critical requirement in AI data center design. Liquid cooling is emerging as an essential approach to support safe and scalable operation in high-density environments.

TE addresses this need with liquid-cooled power solutions that integrate cooling directly into power delivery systems, helping to enable higher power delivery and improved thermal management for next-generation infrastructure. TE's liquid-cooled vertical busbar technology helps achieve higher power densities.

 

Advancing Optical Connectivity for AI at Scale
Higher bandwidth, lower latency, and improved efficiency are also pushing optical interfaces closer to compute—reshaping data movement and data center architectures. With end-to-end optical infrastructure spanning near-chip interfaces to rack-level solutions, TE helps enable efficient, scalable optical architectures that support high-performance computing workloads.

 

Driving Innovation Through Ecosystem Partnerships
TE collaborates closely with industry leaders to co-develop adaptive, future-ready AI infrastructure.

 

At COMPUTEX 2026 (Nangang Exhibition Center Hall 1, Booth #J0106), TE will showcase AI data center connectivity innovations alongside Wiwynn, a leading cloud IT infrastructure provider, highlighting how the broader ecosystem is accelerating next-generation infrastructure deployment.

 

“The rapid evolution of AI infrastructure is driving continued advancements in data center power efficiency, thermal management, and high-speed interconnects,” said Tony Wen, vice president at Wiwynn. “Our collaboration with TE at COMPUTEX 2026 highlights the important role of innovations such as HVDC, liquid-cooled busbar and optical scale-up in enabling next-generation AI data centers, and will help accelerate the deployment of more efficient, scalable AI infrastructure for hyperscalers.”

 

Backed by deep partnerships and a resilient global supply chain, TE helps customers scale with confidence to meet the evolving demands of AI.

Additional Information

Further information on TE’s AI and data center solutions can be found at te.com/AI

About TE Connectivity

TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence, and more.


Our more than 90,000 employees, including 10,000 engineers, work alongside customers in approximately 130 countries. In a world that is racing ahead, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Instagram.