- TE Internal #: 1318382-3
- TE Internal Description: 025 CAP HSG ASSY 16P
-
PCB Mount Orientation : Horizontal
-
Termination Method to PCB : Through Hole - Solder
-
Sealable : No
-
Centerline (Pitch) : 2.2 mm [ .087 in ]
-
Connector System : Wire-to-Board
Documents
CAD Files
-
Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
- 3D PDF 3D_CVM_CVM_1318382-3_D.pdf 3D
- Customer View Model ENG_CVM_CVM_1318382-3_D.2d_dxf.zip English
- ENG_CVM_CVM_1318382-3_D.3d_igs.zip English
- ENG_CVM_CVM_1318382-3_D.3d_stp.zip English
Product Specifications
- 025 SERIES I/O CONNECTORS (SMD-Type) JPN_SS_108-5849-1_A.pdf Japanese
- JPN_SS_108-5849-1_A.tif Japanese
- Application Specification JPN_SS_114-5250_C1.tif Japanese
- JPN_SS_114-5250_C1.pdf Japanese
- Product Specification JPN_SS_108-5660-1_B1.pdf Japanese
- JPN_SS_108-5660-1_B1.tif Japanese
- JPN_SS_108-5660_B1.pdf Japanese
- JPN_SS_108-5660_B1.tif Japanese
- JPN_SS_108-5668_H8.pdf Japanese
- JPN_SS_108-5668-1_H6.pdf Japanese
- JPN_SS_108-5931_A4.pdf Japanese
- JPN_SS_108-5931-1_A3.pdf Japanese
- Qualification Test Report ENG_SS_501-5372_A6.pdf English
- JPN_SS_501-5596_A2.pdf Japanese
Instruction Sheets
- Instruction Sheet (non U.S.) ENG_SS_411-5928_G5.pdf English
- JPN_SS_411-5928-1_G5.pdf Japanese
