Join TE Connectivity (TE) at DESIGNCON, booth #639, to learn more about our broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures. 

At DESIGNCON, TE will showcase advances in rack-level power and connectivity, including LVDC/HVDC distribution, liquid cooling, and next-generation high-speed, high-density solutions that support hyperscale, AI/ML, and HPC workloads.

• Rack-Level Connectivity Solutions
• 448G/Lane Co-Packaged Copper Connectivity
• 200G OTB AdrenaLINE Catapult UHD Connector
• AdrenaLINE Slingshot High-Density Active Cabled Backplane
• Active Copper Cables with Redriver Solution
• Ultra-Low Profile PCIe Gen 7 ICC Solution
• 1.6T Optics
• LVDC/HVDC Data Center Rack Power Solutions
• Liquid Cooling Solutions

• Performance Criteria & Practical Implementation of De-embedding Test Fixtures for 200 Gb/s Per Lane Conformance Testing 
  • Presented by Jason Ellison 
  • Wednesday, February 25 | 9:00am
• 400G Channels for AI Applications: Passive & Active Copper Cable Assemblies to Enable Scale Up/Scale Out
  • Presented by Ashika Pandankeril Shaji
  • Wednesday, February 25 | 11:15am        
• Near-Chip, Co-Packaged Copper & Co-Packaged Optics Interconnects: A Comparison of Socket Options for 224 to 448 Gbps 
  • Presented by Chad Morgan
  • Wednesday, February 25 | 3:00pm
• Crosstalk Sensitivity New Finding on PCIe 7.0 Channel Through S-Parameter Manipulation 
  • Presented by Quresh Bohra
  • Thursday, February 26 | 3:00pm