Superior Thermal Performance and Durability
Our innovative thermal bridge technology provides up to 2x better thermal resistance over traditional thermal technologies such as gap pads or thermal pads. This solution was developed as customers seek ways to dissipate more heat associated with increasing system power requirements, specifically in fixed cooling applications with restricted airflow, liquid cooling or cold plates.
Learn more about how TE Connectivity's innovative thermal bridge technology compares with traditional approaches of heat dissipation for a consistent, long lasting thermal performance.
- Up to 2x better thermal resistance over most traditional thermal technologies
- Near-zero plate gap in the thermal bridge construction for optimized compression and thermal transfer
- Optimized for applications using cold plates with liquid cooling or heat pipes, ganged heatsinks or direct chassis conduction applications with little to no airflow
- Consistent, long-lasting thermal performance with an elastic compression design that is resistant to set and relaxation over time
- Low and consistent compression force between cold plate and I/O plug
- Lasts longer than traditional thermal technologies to reduce component replacements needed during servicing
Introducing TE Connectivity’s Thermal Bridge Technology: A New Approach, A New Level of I/O Application Benefits
Introducing TE Connectivity’s Thermal Bridge Technology
A New Approach, A New Level of I/O Application Benefits
Today’s data communication applications have increasingly demanding system power requirements — which often require better ways to dissipate heat. Traditional thermal management approaches such as riding heatsinks don’t always provide the optimum solution for applications with restricted airflow, liquid cooling or cold-plates. But what if there was a new way to approach this problem?
We have the solution —TE’s new thermal bridge technology for input/output applications. It was developed in direct response to market needs for a better performing thermal solution and provides up to 2X better thermal resistance over traditional thermal technologies.
Aimed at data communications and wireless markets, and supporting applications such as high-performance computing, ethernet switches, 5G/wireless, servers and ethernet SP routing, our new technology offers three key benefits:
1. Superior thermal resistance
2. Better reliability and durability
3. Improved application serviceability
As a mechanical alternative to traditional gap pad or thermal interface materials, the thermal bridge sits on top of the cage – sandwiched between the cage and heatsink. The innovative design is not a traditional heatsink.
Whereas many riding heatsink solutions rely on airflow for heat dissipation, the thermal bridge is best suited for applications with limited or no airflow.
An interleaved series of plates allows heat to pass from the I/O module to the cooling area, while providing the necessary normal force, which is built into the thermal bridge.
Integrated mechanical springs provide interface force and 1.0 mm of compression travel, simplifying the mechanical design and reducing the need for external compression hardware.
The elastic compression design makes the thermal bridge resistant to set or relaxation over time. This helps provide consistent and longer-lasting performance and helps to reduce component replacement during servicing.
TE’s thermal bridge technology — yet another next-gen innovation from TE to address customer needs.
- Spring loaded bridge offers 1.0mm (typical) of z-axis compression
- Individual plate actuation allows for surface conformability in the x-axis
- Dual-spring design allows for tilt conformability in the y-axis
- At 3 points of contact per plate, a typical bridge will have 150+ points of contact to adjacent surface
- Dry interface resistance 20-40% lower than most traditional riding heatsinks
Thermal bridge technology is the latest thermal innovation from TE Connectivity (TE) and provides up to 2x better thermal resistance over traditional thermal technologies such as gap pads or thermal pads. This solution was developed as our customers seek ways to dissipate more heat associated with increasing power requirements, specifically in applications with restricted airflow, liquid cooling or cold plate applications.
How the Thermal Bridge Technology Works
Our new, innovative thermal bridge technology replaces the traditional gap pad or thermal interface material (TIM) with integrated mechanical springs to provide interface force and 1.0mm of compression travel. This interleaved series of parallel plates allows heat to pass from the I/O module to the cooling area.
Frequently Asked Questions (FAQs)
Q: What are the best applications for using thermal bridge technology?
A: This solution was developed to dissipate heat in applications that use cold plates with liquid cooling or heat pipes, ganged heatsinks or direct chassis conduction applications with little to no airflow. It is a mechanical alternative to the traditional gap pad or thermal interface material (TIM).
Q: How does the thermal bridge work with fixed heat sink and cooling applications?
A: The thermal bridge solution is optimized for applications where the heat sink or cold plate is at a fixed location. For these types of applications, normally TIMs or gap pads are used and require a high level of compression to bring the thermal resistance down. These TIMs and gap pads tend to relax or set over time, decreasing the performance. TE’s thermal bridge technology replaces the gap pad in these applications with a mechanical, compressible gap pad, providing low-compression force and low thermal resistance, making this solution more reliable over time.
QSFP-DD Connectors, Cages and Cable Assemblies
QSFP-DD doubles the density of QSFP and eight differential pairs capable of 50 Gbps each to achieve 400GbE while allowing existing QSFP modules to be plugged into the same cage. The QSFP-DD specification provides both single-height and stacked configurations of the cage/connector system, supporting QSFP modules and QSFP-DD modules through an additional recessed row of contacts.