QSFP-DD Interconnects

TE Connectivity (TE) stacked quad small form factor pluggable double density (QSFP-DD) 112G connectors and cages are the next generation of data infrastructure interconnect solutions to support high density data centers, cloud computing, and artificial intelligence operations. Stacked QSFP-DD 112G solutions enable operations at 112G PAM4 speeds, and are built to mechanical and performance standards developed by companies under a QSFP-DD multi-source agreement (MSA). TE offers a complete vertically integrated manufacturing solution, with expertise in both connector and thermal development.

• TE’s next generation QSFP-DD products are aligned with the industry’s 112G channel performance needs on signal integrity performance.

• QSFP-DD cages are fully backwards compatible, providing an upgrade path from existing QSFP solutions - allowing an economical path to upgrade to 112G operations.

• Due to demands on next generation designs to support hyperscale data centers and machine learning infrastructures, TE has developed one of the most comprehensive and flexible 112G portfolios on the market.

TE Connectivity's new Our QSFP-DD 112G SMT receptacle connectors can address next-generation data center needs by increasing density in an existing QSFP form factor to reach speeds up to 800 Gbps. These products are designed for 800 Gbps PAM-4 protocols. TE’s QSFP-DD products work cost effectively in 15-18W applications leveraging proprietary heat sink technology. Our new connectors are fully backward-compatible, providing an easy upgrade path from existing QSFP solutions. TE offers a broad QSFP-DD portfolio which includes 1x1 to 1x6 cages and SMT connectors. Custom lightpipes, heatsinks are also available.

TE’s QSFP-DD 2x1 cages and connectors add to the wide range of existing QSFP-DD surface mount products, providing customers with additional design options for 400G applications, through a robust, consistent and cost effective solution. These products address both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades. QSFP-DD 2x1 cages and connectors’ stacked configuration allows for more height from the host board to allow for a more unified airflow and larger ASIC heat sink. These solutions can be a cost effective, cooling high power applications (15-18W) by leveraging proprietary heat sink technology.