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Overview
DDR4 SO DIMM Sockets
DDR4 SO DIMM Sockets are designed to JEDEC industry standards. They are available with standard and reverse key positions, GF, 5u", 10u", 15u", and 30u" gold thicknesses, 4.0mm, 5.2, 8.0, and 9.2 heights, and tray and reel packaging. DDR4 SO DIMM Socket applications include mass storage, communications, desktop PCs, and instrument equipment.
Product Features
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DRAM Type: Small Outline (SO)
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Module Orientation: Right Angle
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Row-to-Row Spacing(mm): 8.2
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Packaging Method: Tape & Reel
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Circuit Application: Power
Overview
Product Features:
Specifications for DDR4 SO DIMM
- Better performance while consuming less power
- System operating costs can be lowered due to higher performance and less power consumption per socket
- Higher chip density and pin count provides larger DIMM capabilities than DDR3 SO DIMM—transmitting more signal at one time
- One of the largest portfolios with a variety of heights and gold plating options
DDR4 SO DIMM memory sockets provide about 30% better performance than DDR3 SO DIMM memory sockets while consuming about 70% less power.
Features
Please review product documents or contact us for the latest agency approval information.
Product Type Features
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Connector & Contact Terminates To Printed Circuit Board
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Connector System Cable-to-Board
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DRAM Type Small Outline (SO)
Configuration Features
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Number of Rows 2
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Module Orientation Right Angle
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Number of Positions 200, 260
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Number of Keys 1
Electrical Characteristics
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DRAM Voltage (V) 1.2
Signal Characteristics
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SGRAM Voltage (V) 1.2
Body Features
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Ejector Type Locking
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Connector Profile High, Low
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Module Key Type Offset Left, Offset Right
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Retention Post Location Both Ends
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Latch Material High Temperature Thermoplastic
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Retention Post Material Copper Alloy, Stainless Steel
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Ejector Location Both Ends
Contact Features
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Contact Current Rating (Max) (A) .5
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Contact Base Material Copper Alloy
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PCB Contact Termination Area Plating Material Gold Flash
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Contact Underplating Material Nickel
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Contact Mating Area Plating Material Gold, Gold Flash
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Contact Mating Area Plating Material Thickness (µm) .127, .254, .381, .76
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Contact Mating Area Plating Material Thickness (µin) 5, 10, 15, 30
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Memory Socket Type Memory Card
Termination Features
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Termination Method to Printed Circuit Board Surface Mount
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Insertion Style Cam-In
Mechanical Attachment
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Connector Mounting Type Board Mount
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PCB Mount Retention Type Solder Peg
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PCB Mount Retention With
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Mating Alignment Type Reverse Keying, Standard Keying
Housing Features
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Housing Color Black
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Housing Material High Temperature Thermoplastic
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Centerline (Pitch) (mm) .5, 2.1, 3.3, 5.4, 6.1, 7.3
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Centerline (Pitch) (in) .02, .082, .129
Dimensions
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Stack Height (mm) 4, 5.2, 8, 9.2
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Stack Height (in) .157, .205, .315, .362
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Row-to-Row Spacing 8.2 mm [ .322 in ]
Usage Conditions
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Operating Temperature Range -55 – 85 °C [ -67 – 185 °F ]
Operation/Application
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Circuit Application Power
Industry Standards
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UL Flammability Rating UL 94V-0
Packaging Features
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Packaging Quantity 500, 800, 900
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Packaging Method Tape & Reel
Reference Number
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TE Internal Number CAT-D33047-SO1339
Related Materials
No documentation available.
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