PRODUCT
active
- Form Factor zSFP+(SFP28)
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 6
- Lightpipe Configuration Quad Triangular (Inner & Outer)
- Lightpipe Style Standard
- Number of Ports 12
- Number of Positions 240
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 1.8
- Operating Temperature Range -55 – 105
- For Use With Pluggable I/O Products zSFP+ SMT Connector
- Pluggable I/O Applications zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type Elastomeric Gasket
- Included Lightpipe Yes
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 4
- Number of Ports 8
- Number of Positions 160
- Data Rate (Max) 16
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications EMI Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe No
PRODUCT
active
- Form Factor zSFP+(SFP28)
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes No
- Connector System Cable-to-Board
- Sealable Yes
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 4
- Number of Ports 8
- Number of Positions 160
- Data Rate (Max) 32
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 1.8
- Operating Temperature Range -55 – 105
- For Use With Pluggable I/O Products zSFP+ Cable Assembly
- Pluggable I/O Applications zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type Elastomeric Gasket
- Included Lightpipe No
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 1
- Number of Ports 2
- Number of Positions 40
- Data Rate (Max) 16
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications SFP+
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Package
- EMI Containment Feature Type External Springs
- Included Lightpipe No
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 4
- Lightpipe Configuration Four Triangular (Inner & Outer)
- Number of Ports 8
- Number of Positions 160
- Data Rate (Max) 16
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications EMI Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 5
- Lightpipe Configuration Four Triangular (Inner & Outer)
- Number of Ports 10
- Number of Positions 200
- Data Rate (Max) 16
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications EMI Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable Yes
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 2
- Lightpipe Configuration Four Triangular (Inner & Outer)
- Number of Ports 4
- Number of Positions 80
- Data Rate (Max) 16
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications SFP+
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Box
- EMI Containment Feature Type Elastomeric Gasket
- Included Lightpipe Yes
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 1
- Lightpipe Configuration Four Triangular (Inner & Outer)
- Number of Ports 2
- Number of Positions 40
- Data Rate (Max) 16
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications EMI Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Box
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 6
- Lightpipe Configuration Four Triangular (Inner & Outer)
- Number of Ports 12
- Number of Positions 240
- Data Rate (Max) 16
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications SFP+
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor zSFP+(SFP28)
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 4
- Lightpipe Configuration Quad Triangular (Inner & Outer)
- Lightpipe Style Standard
- Number of Ports 8
- Number of Positions 160
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 1.8
- Operating Temperature Range -55 – 105
- For Use With Pluggable I/O Products zSFP+ SMT Connector
- Pluggable I/O Applications zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor SFP
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 1
- Lightpipe Configuration Quad Triangular (Inner & Outer)
- Lightpipe Style Standard
- Lightpipe Profile Standard
- Number of Ports 2
- Number of Positions 40
- Data Rate (Max) 4
- Contact Current Rating (Max) .5
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Centerline (Pitch) .8
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications SFP
- Circuit Application Signal
- EMI Containment Feature Type EMI Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 1
- Lightpipe Configuration Single Triangular (Outer)
- Number of Ports 2
- Number of Positions 40
- Data Rate (Max) 16
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications EMI Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Package
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor SFP
- Product Type Cage Assembly
- Cage Type Ganged
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 2
- Lightpipe Configuration Dual Square
- Lightpipe Style Standard
- Lightpipe Profile Standard
- Number of Ports 2
- Data Rate (Max) 4
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Operating Temperature Range -55 – 85
- Pluggable I/O Applications SFP
- Circuit Application Signal
- EMI Containment Feature Type EMI Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor SFP+
- Product Type Cage
- Cage Type Single
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 5
- Number of Ports 5
- Data Rate (Max) 16
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- PCB Thickness (Recommended) 1.5
- Tail Length 2.05
- Operating Temperature Range -55 – 105
- For Use With Pluggable I/O Products SFP+ SMT Connector
- Pluggable I/O Applications SFP+ Enhanced
- Heat Sink Compatible Yes
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe No
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 2
- Number of Ports 4
- Number of Positions 80
- Data Rate (Max) 16
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications EMI Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Package
- EMI Containment Feature Type External Springs
- Included Lightpipe No
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly
- Cage Type Ganged
- Included Heat Sink Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 2
- Number of Ports 2
- Data Rate (Max) 16
- Heat Sink Style Pin
- Heat Sink Height Class PCI
- Heat Sink Height 4.2
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- PCB Thickness (Recommended) 2.25
- Tail Length 2.05
- Operating Temperature Range -55 – 105
- For Use With Pluggable I/O Products SFP+ SMT Connector
- Pluggable I/O Applications SFP+ Enhanced
- Circuit Application Signal
- Heat Sink Compatible Yes
- Packaging Method Box & Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe No
PRODUCT
active
INF-8074i
- Form Factor SFP
- Product Type Cage
- Cage Type Single
- Included Heat Sink No
- Integrated Lightpipes No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 1
- Lightpipe Configuration Dual Round
- Lightpipe Style Standard
- Lightpipe Profile Standard
- Number of Ports 1
- Data Rate (Max) 4
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Copper Alloy
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 85
- For Use With Pluggable I/O Products SFP SMT Connector
- Pluggable I/O Applications SFP
- Heat Sink Compatible No
- Packaging Method Box & Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
SFF-8083
SFF-8432
- Form Factor zSFP+(SFP28)
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 2
- Lightpipe Configuration Three
- Lightpipe Style Standard
- Number of Ports 4
- Number of Positions 80
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 1.8
- Operating Temperature Range -55 – 105
- For Use With Pluggable I/O Products zSFP+ SMT Connector
- Pluggable I/O Applications SFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 2
- Number of Ports 4
- Number of Positions 80
- Data Rate (Max) 16
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Contact Mating Area Plating Thickness .76
- Tail Plating Material Tin
- Termination Method to Printed Circuit Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- Centerline (Pitch) .8
- PCB Thickness (Recommended) 1.5
- Tail Length 3
- Operating Temperature Range -55 – 105
- Pluggable I/O Applications SFP+
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Package
- EMI Containment Feature Type External Springs
- Included Lightpipe No
PRODUCT
active
- Form Factor SFP+
- Product Type Cage Assembly
- Cage Type Ganged
- Included Heat Sink No
- Integrated Lightpipes No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 4
- Lightpipe Configuration Dual Round
- Lightpipe Style Standard
- Lightpipe Profile Ultra Low
- Number of Ports 4
- Data Rate (Max) 16
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver
- PCB Thickness (Recommended) 2.25
- Tail Length 2.05
- Operating Temperature Range -55 – 105
- For Use With Pluggable I/O Products SFP+ SMT Connector
- Pluggable I/O Applications SFP+
- Circuit Application Signal
- Heat Sink Compatible No
- UL Flammability Rating UL 94V-0
- Packaging Method Box & Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes