TE Connectivity’s advanced thermal management solutions address the increasing heat dissipation demands of modern I/O applications. Our innovative Thermal Bridge Technology provides better thermal resistance compared to traditional gap pads or thermal pads, while our Advanced High-Speed I/O Liquid Cooling & Thermal Bridge Hybrid Solution integrates liquid cooling cold plates to tackle the tough thermal challenges. These solutions are engineered for fixed cooling applications with restricted airflow, such as liquid cooling systems or cold plates, making them ideal for hyperscale data centers, AI/ML, and HPC workloads.
TE Connectivity’s thermal management portfolio now includes the groundbreaking Advanced High-Speed I/O Liquid Cooling & Thermal Bridge Hybrid Solution. This hybrid approach combines our patented thermal bridge technology with liquid cooling cold plates, delivering enhanced heat dissipation for power-dense AI applications (up to 40W per module). Alongside our Thermal Bridge Technology, which offers better thermal resistance than traditional methods, this solution ensures reliability and scalability in fixed cooling environments with minimal airflow.
Our Advanced High-SpeedI/O Liquid Cooling & Thermal Bridge Hybrid Solution integrates liquidcooling cold plates to tackle the most challenging thermal issues. These solutions are engineered for fixed cooling applications with restrictedairflow, such as liquid cooling systems or cold plates, making them idealfor hyperscale data centers, AI/ML, and HPC workloads.
Introducing TE Connectivity’s Thermal Bridge Technology: A New Approach, A New Level of I/O Application Benefits
Our new, innovative thermal bridge technology replaces the traditional gap pad or thermal interface material (TIM) with integrated mechanical springs to provide interface force and 1.0mm of compression travel. This interleaved series of parallel plates allows heat to pass from the I/O module to the cooling area.
Q: What are the best applications for using thermal bridge technology?
A: This solution was developed to dissipate heat in applications that use cold plates with liquid cooling or heat pipes, ganged heatsinks or direct chassis conduction applications with little to no airflow. It is a mechanical alternative to the traditional gap pad or thermal interface material (TIM).
Q: How does the thermal bridge work with fixed heat sink and cooling applications?
A: The thermal bridge solution is optimized for applications where the heat sink or cold plate is at a fixed location. For these types of applications, normally TIMs or gap pads are used and require a high level of compression to bring the thermal resistance down. These TIMs and gap pads tend to relax or set over time, decreasing the performance. TE’s thermal bridge technology replaces the gap pad in these applications with a mechanical, compressible gap pad, providing low-compression force and low thermal resistance, making this solution more reliable over time.
