High Speed Backplane Connectors

Keeping Data Flowing

Our broad portfolio of high-speed backplane connectors provides you with the design flexibility you require to solve specific performance challenges. Consider our high-speed backplane connectors for your server, switch, router, and optical transport applications.

High Speed Backplane Connector Data Rates

High Speed Backplane Connector Data Rates

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Signal Integrity

TE Connectivity gets the best performance out of connectors by applying system-level signal integrity design expertise to each high-speed product. Our modeling and simulation skills are second to none with global expertise in the U.S., Europe, and Asia. Our global presence places simulation, modeling, and system layout experts next to the customer.

Modeling and Simulation

At TE, the design process starts with signal integrity. Signal integrity engineers use sophisticated 3D tools to provide accurate connector and footprint via pattern performance prior to production. We have the tools and expertise to get the right answer.

  • Ansys HFSS and CST Microwave Studio Full-wave 3D tools
  • Both connector and footprint via pattern(s) analyzed before production
  • S-parameter and SPICE analysis
  • Sophisticated ADS and MATLAB system analysis
Modeling and Simulation

Test Capability

With measurement capabilities beyond 12.5 Gbps and 50 GHz, TE can characterize and provide detailed measurements for its products. Cutting-edge measurement calibration techniques and board design enable accurate de-embedding of test fixtures. TE has also teamed with numerous silicon companies to provide active device measurements that can be invaluable to assure the successful implementation of a design.

  • Advanced calibration techniques de-embed fixture
  • Frequency domain to 50 GHz
  • Time domain eye pattern/BERT to 12.5 Gbps
  • Active silicon testing – multiple vendors 2 – 10+ Gbps
  • Both system and “connector only” boards
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Customer Support and Tools

From test boards to simulation models, TE provides a library of tools that help you successfully implement your system.

 

Request electrical models

 

  • Ansys HFSS and CST Microwave Studio full-wave 3D tools
  • Both connector and footprint via pattern(s) analyzed before production
  • S-parameter and SPICE analysis
  • Sophisticated ADS and MATLAB system analysis
  • Measurement based S-parameter connector models (64+ ports)
  • Modeling based S-parameter connector models (64+ ports)
  • Footprint via pattern S-parameter and SPICE models
  • SPICE connector models
  • Connector evaluation test boards
  • System test boards
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Select Applications

Increasing Data Rates, Decreasing Signal Rise: Better Performance for High Speed
  • Servers: blade, rack mount, and mainframe stackable, carrier grade, core, edge, and Metro Ethernet
  • Switches: stackable, carrier grade, core, edge, and Metro Ethernet
  • Routers: edge, core, enterprise class, carrier Ethernet, BRAS, and Multi Service Edge
  • Optical Transport: carrier grade optical, metro WDM, optical multi-service provisioning, long haul optical, and enterprise LAN optical Ethernet