Industry Tradeshow
DesignCon 2021
Enabling Next Gen Architectures
August 16-18, 2021
San Jose McEnery Convention Center
San Jose, CA | USA
TE’s presentation and panel discussion will include:
- System Design for 112G: Device characteristics, channel details and expected system performance - presented by Dr. Karl Bois, senior principal system technologist, TE Connectivity.
- Panel: “Interoperable Common Electrical Interfaces (CEI) and Channel Standards Update: An OIF Perspective” - Nathan Tracy, technologist and Industry Standards manager, TE Connectivity.
In collaboration with thought leaders from Amazon and Semtech, the whitepaper by Dr. Bois and Mr. Tracy discusses major design aspects of system and device implementations at 112 Gb/s (PAM-4) per lane signaling rate. Emerging cutting-edge usage models are an indicator the market is pushing industry standards to adopt higher signaling speeds and connectivity technology. The contributing authors address passive interconnects, signal integrity characteristics, device package substrates, I/O equalization blocks and the latency resulting from Forward Error Correction (FEC) to meet required system Bit Error Ratio.
TE is a key contributor to industry standards and forums that enable future connectivity systems. TE’s Nathan Tracy, serving as OIF’s Vice President of Marketing, will lead a panel of OIF member experts discussing the status of CEI-112G and CEI-224G electrical interface implementation efforts. These standardization efforts will enable the next levels of cloud, service provider and enterprise computing and networking performance. TE’s thought leaders are committed to moving the industry forward through active advocacy of industry standards, such as participation in these efforts, where technical contributions are vital.
Click to watch an overview of all of our demos showcased at DesignCon 2020
5G networks will accelerate data up to 100 times faster than today's technology. This will require advanced connectivity for broader bandwidth and high-clarity communications. Increased data speeds in the future will enable an interactive ecosystem for a smarter, productive, and connected world. We at TE, are building this future today. We’re ready to help you with solutions that support speeds up to 100 times those of 4G networks. TE is leading the industry with a full spectrum of ultra-compact, impossibly powerful solutions for optimizing 5G connectivity.
Featured Products
-
OSFP Connectors & Cable Assemblies
TE’s Octal Small Form Factor Pluggable (OSFP) connectors and cable assemblies address next-generation data center needs by supporting aggregate data rates of 200 Gbps and up to 400 Gbps. These products are designed for both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades.
-
QSFP-DD Interconnects
QSFP-DD (quad small form-factor pluggable double density) doubles the density of QSFP interconnects with an eight-lane electrical interface capable of 28 Gbps NRZ or 56 Gbps PAM-4 to achieve 200 or 400 Gbps aggregate per port. Our QSFP-DD connector portfolio’s backwards compatibility allows existing QSFP modules to be plugged into QSFP-DD ports. Additionally, our QSFP-DD cages feature a proprietary heat sink design, making them the only solution to work in 15-18W applications at a low cost – providing superior thermal and signal integrity performance.
-
Rugged Connector Sealing and Cable Assembly Systems
Our rugged connector sealing systems are designed to provide high signal data connectivity. These products are built to industry standards, incorporating fiber optic and copper interconnects for both factory-made and field-installable cable assemblies. FullAXS, Full AXS Mini and Multi-Fiber cable assembly enclosures are scalable and easy to install, making them an optimal solution for wireless outdoor applications, in some of the toughest environments. Designed for a broad range of transceivers, and with a connector shell that allows for easy one-handed mating, the product offers a bulkhead construction to plug these cable assemblies directly into optical transceivers or other connector types.
-
SFP Connector Types: SFP-DD, SFP28, SFP56, SFP+, zSFP+
Our broad SFP portfolio of small form-factor pluggable (SFP) connectors can provide comprehensive and customizable solutions to address your I/O interconnects. The SFP portfolio connectors is designed to transfer data at speeds of up to 28G NRZ and 56G PAM-4. Choose from SFP-DD, SFP28 & SFP56, SFP+, and SFP products, depending on your system architecture, e.g. PCB space, speed, channel and port density requirements. Each of our SFP connectors features surface-mount technology (SMT) connectors and cages in multiple configurations. With our innovative thermal bridge technology, SFP products can help dissipate heat and improve system performance, while requiring less power to operate the overall system.
Industry Tradeshow
DesignCon 2021
Enabling Next Gen Architectures
August 16-18, 2021
San Jose McEnery Convention Center
San Jose, CA | USA
TE’s presentation and panel discussion will include:
- System Design for 112G: Device characteristics, channel details and expected system performance - presented by Dr. Karl Bois, senior principal system technologist, TE Connectivity.
- Panel: “Interoperable Common Electrical Interfaces (CEI) and Channel Standards Update: An OIF Perspective” - Nathan Tracy, technologist and Industry Standards manager, TE Connectivity.
In collaboration with thought leaders from Amazon and Semtech, the whitepaper by Dr. Bois and Mr. Tracy discusses major design aspects of system and device implementations at 112 Gb/s (PAM-4) per lane signaling rate. Emerging cutting-edge usage models are an indicator the market is pushing industry standards to adopt higher signaling speeds and connectivity technology. The contributing authors address passive interconnects, signal integrity characteristics, device package substrates, I/O equalization blocks and the latency resulting from Forward Error Correction (FEC) to meet required system Bit Error Ratio.
TE is a key contributor to industry standards and forums that enable future connectivity systems. TE’s Nathan Tracy, serving as OIF’s Vice President of Marketing, will lead a panel of OIF member experts discussing the status of CEI-112G and CEI-224G electrical interface implementation efforts. These standardization efforts will enable the next levels of cloud, service provider and enterprise computing and networking performance. TE’s thought leaders are committed to moving the industry forward through active advocacy of industry standards, such as participation in these efforts, where technical contributions are vital.
Click to watch an overview of all of our demos showcased at DesignCon 2020
5G networks will accelerate data up to 100 times faster than today's technology. This will require advanced connectivity for broader bandwidth and high-clarity communications. Increased data speeds in the future will enable an interactive ecosystem for a smarter, productive, and connected world. We at TE, are building this future today. We’re ready to help you with solutions that support speeds up to 100 times those of 4G networks. TE is leading the industry with a full spectrum of ultra-compact, impossibly powerful solutions for optimizing 5G connectivity.
Featured Products
-
OSFP Connectors & Cable Assemblies
TE’s Octal Small Form Factor Pluggable (OSFP) connectors and cable assemblies address next-generation data center needs by supporting aggregate data rates of 200 Gbps and up to 400 Gbps. These products are designed for both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades.
-
QSFP-DD Interconnects
QSFP-DD (quad small form-factor pluggable double density) doubles the density of QSFP interconnects with an eight-lane electrical interface capable of 28 Gbps NRZ or 56 Gbps PAM-4 to achieve 200 or 400 Gbps aggregate per port. Our QSFP-DD connector portfolio’s backwards compatibility allows existing QSFP modules to be plugged into QSFP-DD ports. Additionally, our QSFP-DD cages feature a proprietary heat sink design, making them the only solution to work in 15-18W applications at a low cost – providing superior thermal and signal integrity performance.
-
Rugged Connector Sealing and Cable Assembly Systems
Our rugged connector sealing systems are designed to provide high signal data connectivity. These products are built to industry standards, incorporating fiber optic and copper interconnects for both factory-made and field-installable cable assemblies. FullAXS, Full AXS Mini and Multi-Fiber cable assembly enclosures are scalable and easy to install, making them an optimal solution for wireless outdoor applications, in some of the toughest environments. Designed for a broad range of transceivers, and with a connector shell that allows for easy one-handed mating, the product offers a bulkhead construction to plug these cable assemblies directly into optical transceivers or other connector types.
-
SFP Connector Types: SFP-DD, SFP28, SFP56, SFP+, zSFP+
Our broad SFP portfolio of small form-factor pluggable (SFP) connectors can provide comprehensive and customizable solutions to address your I/O interconnects. The SFP portfolio connectors is designed to transfer data at speeds of up to 28G NRZ and 56G PAM-4. Choose from SFP-DD, SFP28 & SFP56, SFP+, and SFP products, depending on your system architecture, e.g. PCB space, speed, channel and port density requirements. Each of our SFP connectors features surface-mount technology (SMT) connectors and cages in multiple configurations. With our innovative thermal bridge technology, SFP products can help dissipate heat and improve system performance, while requiring less power to operate the overall system.
