SO DIMMs optimize speed and usability

A small outline dual inline memory module (SO DIMM) socket can enable reliable connection to standard memory modules. SO DIMM sockets are designed for the latest DDR4, as well as previous versions DDR3, DDR2, DDR, and SDRAM memory modules. For DDR1 and DDR2 SO DIMM sockets, the pin count is 200 pins; for DDR3 SO DIMM sockets, the pin count is 204 pins; for DDR4 SO DIMM sockets, the pin count is 260 pins.


Product Features
  • Better performance while consuming less power
  • System operating costs can be lowered due to higher performance and less power consumption per socket
  • Higher chip density and pin count provides larger DIMM capabilities than DDR3 SO DIMM—transmitting more signal at one time
  • One of the largest portfolios with a variety of heights and gold plating options

Product Overview

SO DIMM Sockets

These memory sockets are designed for JEDEC small outline dual inline memory modules (SO DIMMs) for the latest double data rate 4 (DDR4), as well as prior DDR3, DDR2, DDR and SDRAM memory modules. Designed to accept the new DDR4 single sided SO DIMM, these connectors ensure durable connectivity to optimize device functionality, speed, and usability.

Frequently Asked Questions

SO DIMM Sockets

Is it possible to stack two SO DIMM module cards by using different height SO DIMM sockets?
Yes, it is possible and 8H or 9.2H height SODIMM socket is suggested to be used with 4H height SODIMM socket, and 9.2H height SODIMM socket is suggested to be used with 5.2H height SODIMM socket. When designing the printed circuit board (PCB), two SODIMM socket footprints are still needed and they can be next to each other, so when inserting the SODIMM module cards to two different height SODIMM sockets, you will find the two module cards are
kind of stacked.

Are all TE memory sockets RoHS compliant and halogen free ?
Yes, TE’s DDR1/2 SODIMM, DDR3 SODIMM, and DDR4 DIMM and SODIMM are all RoHS compliant and halogen free.


What is the suggested thickness of solder paste on the printed circuit board (PCB) for surface mount technology (SMT) memory sockets?
For SMT type TE memory sockets, 0.13mm solder paste thickness is suggested to achieve the required flatness specification.

Select Applications:

SO DIMM Sockets