Land Grid Array (LGA) Sockets

LGA sockets for the next generation

A land grid array (LGA) socket can provide compressive electrical interconnect between the printed circuit boards (PCB) and the processor. LGA sockets are one of the latest socket technologies for x86 LGA microprocessor packages that range in size up to 4200 pins. These sockets can provide a compressive electrical interface to the microprocessor package and are solder ball, surface mount attached to the PCB. Our LGA sockets have flexible tooling that can provide high-quality and fast turnaround time for prototypes, enabling the sockets to be ready for use at an early stage of your program. Our LGA sockets are used in high-performance computing, servers, workstations, and desktop computers.

Data Sheet
LGA 4189 Sockets and Hardware (English)
Data Sheet
LGA 3647 Sockets (English)
Data Sheet
XLA Sockets (English)
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Featured Products

LGA 4189 Socket and Hardware

  • LGA 4189 Sockets

    Our LGA 4189 socket and hardware support next-generation CPUs for higher performance and better system scaling. LGA 4189 sockets are designed to enable next generation processors which support PCIe Gen 4 and four or eight multi-processor system architectures.

  • LGA 4189 Hardware

    We manufacture both socket and hardware parts, providing you with a full solution.

LGA Socket Family
XLA Socket

XLA Socket
LGA 3647

LGA 3647
LGA 2011

LGA 2011
LGA 115X

LGA 115X
LGA 4189

LGA 4189

Product Features:

LGA Sockets
  • Socket housing facilitates efficient soldering to the PCB.
  • Socket is supplied with a cap to facilitate vacuum pick and place.
  • Backplates are available in zinc or nickel plating.
XLA Sockets
Our distinctive new XLA socket technology provides more reliable performance with warpage 78% better than traditional molded LGA sockets. This socket is made with printed circuit board (PCB) substrate instead of other plastic materials, which means the socket does not warp differently than the PCB to which it is mounted. This warpage control allows for 33% better true positioning when the socket is mounted to the PCB and when the processor is installed in the socket. XLA socket technology offers scalability for pin counts up to 10,000+ positions, enabling the largest one piece socket in the market. With capability up to 56Gbps data rates, the XLA socket is a great combination of speed and size.

Featured Product

LGA 3647 Sockets

  • LGA 3647 Sockets

    Our LGA 3647 socket is designed for Intel’s next-generation CPU processors. The new socket allows designers to take advantage of the higher performance, better system application scaling processors. The LGA 3647 socket is the first to feature a two-piece design that reduces warping and offers better coplanarity for improved reliability. As a validated suppliers of this technology, TE is your dependable, high-quality source for this new CPU processor socket.

Product Details:

LGA 3647 Socket
  • Pitch: 0.9906mm Hex
  • SP Height: 2.7mm
  • Cont. NF: 25gf @ nominal def.
  • Pin count: 3647
  • Pin array: 49x74
  • Multi-piece housing: 2 piece

Award-Winning Product:

  • Read the story on TE's recognition for LGA 3647 socket

    After an intense five-month contest against 74 major electronics suppliers, TE's LGA 3647 socket was recently awarded Best Passive Component at the EEPW (Electronic Engineering & Product World) 2016 Editors' Choice Awards – selected by more than 2,000 industry insiders.

LGA 3647 Socket and Hardware

LGA 3647 Socket and Hardware

Now Available:

  • View LGA 3647 Socket P0 Hardware

    We are a validated supplier of LGA 3647 Socket hardware including back plates, bolster plates, and clips/carriers for Socket P0. With a narrow fabric and a narrow non-fabric offering, this new hardware system provides better alignment and keeps fingers away from the socket contact field.

  1. LGA 3647 Socket and Hardware (English)

TE’s new LGA 3647 socket and hardware allows designers to take advantage of Intel’s new high performance processors that also offer better system scaling.
LGA 3647 Socket and Hardware

Select Applications:

LGA Sockets
ChipConnect Cable Assemblies

Product Group

ChipConnect Cable Assemblies

ChipConnect internal faceplate-to-processor cable assemblies enable Intel Omni-Path Architecture (OPA) by mating directly with LGA 3647 sockets at the processor and QSFP28 port at the faceplate for 25 Gbps speeds.

Product Group

Pin Grid Array (PGA) Sockets

TE offers a pin grid array (PGA) socket for your complex printed circuit.
5G/AI Interactive Experience

5G/AI Interactive Experience

5G networks will support exponentially higher data loads, a key factor in the evolution of smarter AI. With access to richer data, improved AIs will boost 5G performance by enhancing security, reducing congestion, and fixing network issues in real time.

Quick Reference Guide - English

Sockets and Hardware for LGA 1156 Processors

TE Connectivity’s surface mount LGA socket was designed for use with Intel’s® Core™ i7 LGA 1156 processor. The contacts have solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The integrated lever mechanism (ILM) generates the Z-axis compression load. A robust bolster plate eliminates PCB bowing during compression. The sockets have been validated to Intel Design Guides.

Quick Reference Guide - English

Sockets and Hardware for LGA 1366 Processors

TE Connectivity’s surface mount LGA socket was designed for use with Intel’s® Core™ i7 LGA 1366 processor. The contacts have .64mm diameter solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The integrated lever mechanism (ILM) generates the Z-axis compression load. A robust bolster plate helps eliminate PCB bowing during compression. The sockets are validated to Intel Design Guides.

Quick Reference Guide - English

LGA 2011 Socket

TE Connectivity's surface mount LGA 2011 socket was designed for use with Intel's Corei7 and Xeon 5LGA 2011 (Sandy Bridge) CPU processors.

Data Sheet

LGA 3647 Socket (English)

TE Connectivity’s (TE) new LGA 3647 socket meets the next-generation designs of Intel’s new CPU processors for higher performance and better system scaling.