Land Grid Array (LGA) Sockets

LGA sockets for the next generation

A land grid array (LGA) socket can provide compressive electrical interconnect between the printed circuit boards (PCB) and the processor. LGA sockets are one of the latest socket technologies for x86 LGA microprocessor packages that range in size up to 4200 pins. These sockets can provide a compressive electrical interface to the microprocessor package and are solder ball, surface mount attached to the PCB. Our LGA sockets have flexible tooling that can provide high-quality and fast turnaround time for prototypes, enabling the sockets to be ready for use at an early stage of your program. Our LGA sockets are used in high-performance computing, servers, workstations, and desktop computers.

Product Features:

LGA Sockets
  • Socket housing facilitates efficient soldering to the PCB.
  • Socket is supplied with a cap to facilitate vacuum pick and place.
  • Backplates are available in zinc or nickel plating.
XLA Sockets
Our distinctive new XLA socket technology provides more reliable performance with warpage 78% better than traditional molded LGA sockets. This socket is made with printed circuit board (PCB) substrate instead of other plastic materials, which means the socket does not warp differently than the PCB to which it is mounted. This warpage control allows for 33% better true positioning when the socket is mounted to the PCB and when the processor is installed in the socket. XLA socket technology offers scalability for pin counts up to 10,000+ positions, enabling the largest one piece socket in the market. With capability up to 56Gbps data rates, the XLA socket is a great combination of speed and size.

Product Details:

LGA 3647 Socket
  • Pitch: 0.9906mm Hex
  • SP Height: 2.7mm
  • Cont. NF: 25gf @ nominal def.
  • Pin count: 3647
  • Pin array: 49x74
  • Multi-piece housing: 2 piece
LGA 3647 Socket and Hardware

LGA 3647 Socket and Hardware

  1. LGA 3647 Socket and Hardware (English)

TE’s new LGA 3647 socket and hardware allows designers to take advantage of Intel’s new high performance processors that also offer better system scaling.