ELCON Micro Power Connectors

Deliver High Current Density in Common Industry Footprint

Our ELCON Micro Wire to Board Solutions can provide a high current up to 12.5A per pin in the common industry footprint of 3.0mm. This current density in a compact design is useful for servers, switches, storage devices and testing machines. A standard industry footprint of connectors and plug kits allows for easy upgrades to existing designs and makes our headers PCB footprint compatible with other suppliers. Custom cable assemblies help complete our high current portfolio allowing design flexibility.

Product Features

ELCON Micro Wire-to-Board Solutions
  • High Current Density 
  • Common Footprint 
  • Virtually Fool-Proof Mating
  • Reliable Performance


Provides high current at 12.5A per pin in the common industry footprint of 3.0mm (contact pitch)


Working Voltage


Performs reliably in harsh environments with maximum operating temperature of 105°C

Select Applications

ELCON Micro Wire-to-Board Solutions
  • Server
  • Switch/Routers
  • Power supplies and distribution
  • Gaming Machines
  • Printers
  • Security Systems
  • Business retail equipment (BRE)
  • Dryers
  • Refrigerator
  • Test Equipment
  • Measurement Equipment
  • Diagnostic equipment
  • Patient Monitor

4 Position Header

8 Position Header

16 Position Header