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Overview

The sensor module includes a high linearity pressure sensor and an ultra low power 24 bit ΔΣ ADC with internal factory calibrated coefficients. It provides a precise digital pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. A high resolution temperature output allows the implementation of a pressure/temperature function without any additional sensor. The communication protocol is standard I2C and SPI interface. Special gel protection and anti-magnetic stainless steel cap allows the use in a harsh environment. This sensor module generation is based on leading MEMS technology. The sensing principle employed leads to very low hysteresis and high stability of both pressure and temperature signal. 

Benefits

  • Operating range: 100 to 1200 mbar, -40 to +125 °C  
  • Improved performance for harsh environment
  • Excellent long term stability
  • High resolution module, 12µbar (1.2Pa)
  • Fast conversion down to 1 ms
  • Low power, 1 µA (standby < 0.15 µA)
  • Supply voltage 2.2 to 3.6 V
  • I2C and SPI interface (Mode 0, 3) 

Features

Please review product documents or contact us for the latest agency approval information.  

Product Type Features

  • Board Level Pressure Sensor Type  Digital Pressure and Altimeter Sensor Modules

  • Board Level Pressure Sensor Style  Absolute

Electrical Characteristics

  • Board Level Pressure Sensor Supply Voltage (V) 2.2 – 3.6

Dimensions

  • Dimensions  6.2 x 6.4 mm [ .24 x .25 in ]

Usage Conditions

  • Pressure (bar) 1

  • Operating Temperature Range (°C) -40 – 125, -40 – 125

  • Operating Temperature Range (°F) -40 – 257, -40 – 257

Operation/Application

  • Output Interface  I²C and SPI (Mode 0, 3)

  • Proof Pressure Range  10 bar

  • Output/Span  24 bit ADC

  • Board Level Pressure Sensor Accuracy  ±4mbar

  • Resolution  .012

Packaging Features

  • Board Level Pressure Sensor Package  Surface Mountable

Reference Number

  • TE Internal Number CAT-BLPS0039

Related Materials

CAD Files

Datasheets & Catalog Pages

Terms and Conditions

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Disclaimer:
This information has been provided to your free of charge for your use but remains the sole property of TE Connectivity Corporation (''TE'') or SnapEDA,  Inc. or Ultra Librarian/EMA Design Automation, Inc. (collectively, "Company"). While Company has used reasonable efforts to ensure its accuracy, Company does not guarantee that it is error-free, not makes any other representation, warranty, or guarantee that the information is completely accurate or up-to-date. In many cases, the CAD data has been simplified to remove proprietary detail while maintaining critical interface geometric detail for use by customers. Company expressly disclaims all implied warranties regarding this information, including but not limited to any implied warranties or merchantability or fitness for a particular purpose.