Industry Tradeshow

Open Compute Project (OCP) 2020

Join us at Open Compute Project (OCP) 2020

March 4-5, 2020

San Jose Convention Center

San Jose, CA | USA

A17

Featured 2020 Products

Power solutions: TE’s power connectors, cable assemblies and value-added busbar solutions can provide simple yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can realize operational and overall system cost savings with TE power products that support low energy consumption. These products are compatible with specifications for use in rack-level busbar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.

 

Internal interconnects: Internal high speed cable and connector solutions can achieve about one-third the loss or three times the reach of advanced printed circuit board routing. Coupled with our Sliver interconnects and STRADA Whisper connector technologies, these solutions can support the performance needed to address next-generation 56G and 112G lanes. 

 

External interconnects: TE continues to be a leader in the industry with I/O solutions for 56G- and 112G-based interconnect solutions supporting 50G, 100G, 200G and 400G links from the data center server, through fabric and spine network layers and equipment for wide-area-network, data center-to-data center connections. 

 

 

Board-to-board and socket: High performance board-to-board products address the need for high data rates with robust signal integrity and power delivery through mate/unmate, including blind-mate service operations commonly found in data center production environments. TE’s socket portfolio includes standard CPU sockets and custom CPU sockets to help customers that want to incorporate their own semiconductor technology and memory interconnects.

Industry Tradeshow

Open Compute Project (OCP) 2020

Join us at Open Compute Project (OCP) 2020

March 4-5, 2020

San Jose Convention Center

San Jose, CA | USA

A17

Featured 2020 Products

Power solutions: TE’s power connectors, cable assemblies and value-added busbar solutions can provide simple yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria while offering improved electrical performance. Engineered solutions support multiple voltage requirements, low resistance and low milli-volt drop. Designers can realize operational and overall system cost savings with TE power products that support low energy consumption. These products are compatible with specifications for use in rack-level busbar applications including power shelves, battery backup unit (BBU) shelves, IT trays and server sleds.

 

Internal interconnects: Internal high speed cable and connector solutions can achieve about one-third the loss or three times the reach of advanced printed circuit board routing. Coupled with our Sliver interconnects and STRADA Whisper connector technologies, these solutions can support the performance needed to address next-generation 56G and 112G lanes. 

 

External interconnects: TE continues to be a leader in the industry with I/O solutions for 56G- and 112G-based interconnect solutions supporting 50G, 100G, 200G and 400G links from the data center server, through fabric and spine network layers and equipment for wide-area-network, data center-to-data center connections. 

 

 

Board-to-board and socket: High performance board-to-board products address the need for high data rates with robust signal integrity and power delivery through mate/unmate, including blind-mate service operations commonly found in data center production environments. TE’s socket portfolio includes standard CPU sockets and custom CPU sockets to help customers that want to incorporate their own semiconductor technology and memory interconnects.