Engineering Leaders: Our Fellows, CTOs, and Select SMEs

Isabell specializes in evaluating and developing new material systems and coatings that make connector contacts and terminals more reliable and fit for future purpose. Her three decades of professional experience in surface and plating technology enables her to understand the intricacies of producing materials cost-efficiently using sustainable manufacturing processes.

Read Q&A with Isabell on innovation in automotive connectivity.

Specialty
Developing materials for contacts used in automobile systems
Analyzing production for more efficient, cost-effective processes

Ask Isabell about
Plating and joining technologies
Analyzing materials and surfaces
Base materials and metal substrates, material systems, and coatings

Achievements
24 patents
More than 60 articles authored

Guenter specializes in innovation for industrial communication, robotics, and I/O connectivity. He works closely with major industrial customers and technology partners to bring new and innovative products to market.

Guenter works at international standardization groups involved in electrical and electronical connectors and interconnections as well as electrical termination technologies like Crimp, IDC, Piercing, Spring Clamp, Press-In connection solutions. For more than three decades, he has served as a delegate, expert and working group chairman to VDE/DKE, IEC, and Cenelec.

Guenter received TE’s prestigious 2019 Lifetime Achievement Award for his nearly forty years of technical leadership and expertise. In addition to being a TE Fellow for the past decade, he amassed several distinctions: 40 granted patents, TE’s 2012 New Innovation Award, and 2016 Impact Innovation Award. His relationships with customers have helped drive competitive advantages that increased TE’s influence in the field of Industrial Communication.

Specialty
Industrial Single Pair Ethernet (SPE) 1 Gbps
Advanced Physical Layer (APL) 10Mbps for 1000m
M12 x-coded, mini I/O Cat-6a 100 Mbps - 10 Gbps
Automation IO connectors
Industrial power and signal and communication connectors

Applications
Industrial Internet, IIoT
Industry 4.0
Cyber Physical Systems

Ask Guenter about
Industrial communication
Sensor to the cloud
Industrial wireless, 5G ACIA
Electrical termination technologies
Industrial standards

Dave specializes in helping customers innovate for high-speed connectivity in data centers.

Read Q&A with Dave on solving for high-speed connectivity in data centers.

Applications
Data center servers, storage, and switches
Hardware accelerators
Wireless systems

Matt specializes in solving for power and signal connectivity, especially when it involves high-speed connectors, PCB interconnects, compliant pin technology, and VME/VPX system solutions.

Read Q&A with Matt on solving for connectivity in aerospace.

Specialty
Rugged connector designs for aerospace

Applications
Spacecraft (manned and unmanned)
Aircraft (manned and unmanned)

Ask Matt about
Connector solutions for VPX architecture

Tom specializes in developing minimally invasive medical devices, with an emphasis on ultrasonic imaging technology.
 

Read Q&A with Tom on designing medical devices.

Specialty
Product platform and process platform development

Ask Tom About
Medical Devices
Cable Assembly
Micro-assembly

Ash specializes in designing wires and cables delivering reliable power and signal connectivity in aerospace applications.

Read Q&A with Ash on connectivity for aerospace.

Specialty
Fluoropolymer Extrusions and Crosslinking
Polymeric materials and technologies

Ask Ash About
Extrusions
High temperature adhesives
Multilayer thin-wall extrusions
Chemically and physically blown foams
Processing and crosslinking high melting high performance thermoplastics
Manufacturing heat shrink tubing and shape memory articles
Special formulations for property enhancement via crosslinking

Chad specializes in analyzing and designing high-speed, high-density components, as well as in developing signal integrity modeling, simulation, and measurement methods for characterizing digital and RF components. He is also focused on characterizing advanced conductor and dielectric materials electrically for high-speed signal transmission.

Read Q&A with Chad on solving for connectivity in data centers.

Specialty
Electromagnetic interconnect modeling (FEA, TLM)
Full system simulation (SPICE, linear, convolution)
Component and system verification testing (TDR, VNA, BERT)
High-speed network analyzer measurement & de-embedding
High-speed right-angle and direct-plug orthogonal designs
Low-skew geometry modeling & novel solutions

Applications
Data center architectures (routers & switches)
Server architectures & disaggregation
Wireless backbone digital applications
High-speed, high-density digital component modeling
High-speed, equalized system simulation
Metal & dielectric electrical characterization at high frequency
External 28-112 Gbps cable assemblies (QSFP, OSFP, QSFP-DD)
Internal low-loss cable assemblies (Sliver cable assemblies)
Cabled backplane solutions (cabled STRADA Whisper connectors)

Ask Chad about
Choosing tools and methods for predicting performance
Achieving low insertion loss and crosstalk to 50 GHz
Removing unwanted resonances from components
Measuring high-frequency material characteristics
Selecting materials for high-speed

John specializes in developing value-adding terminal and connector solutions for automotive applications, using low-cost materials and processes.

Read Q&A with John on connectivity in automotive.

Specialty
Automotive terminal and connector design

Applications
Low-voltage miniaturized automotive terminals and connectors

Ask John about
Designing terminals and connectors
Surface mount headers and compliant pins
Contact physics

Helge specializes in designing contacts used in automotive applications.

Read Q&A with Helge on connectivity in automotive.

Ask Helge about
Contact designs and materials

Josef specializes in process improvement and process innovation in stamping, plating, molding and assembly.

Read Q&A with Josef on solving for improvements in manufacturing processes.

Ask Josef about
Manufacturing and automation
Stamping dies
Injection molds
Digital factory

Frank specializes in taking innovation concepts and developing them into functional, sustainable manufacturing processes.

Read Q&A with Frank on solving for innovation in manufacturing.

Specialty
Manufacturing innovations (plating, stamping, molding)
Pilot and deployments in manufacturing
Sustainability optimization (energy, process water, chemicals)
Engineering and operational excellence

Ask Frank about
New opportunities with manufacturing transformation (digital factory)

Dave specializes in developing sensors – primarily MEMS-based sensors and electronic sensor systems.

Read Q&A with Dave on solving for connectivity in sensors.

Ask Dave about
Sensor requirements and trends

Bill helps customers solve for high-speed, ruggedized, small form factor and low-cost optical transceivers.

Read Q&A with Bill on solving for connectivity in technology.

Specialty
End-to-end networking solutions for high speed communications

Applications
Aerospace systems
Transportation systems
Medical devices
Fiber optic sensing

Ask Bill about
Fiber optics
High speed communications
Networking - all types

Alan Amici serves as the Vice President and Chief Technology Officer for TE Connectivity’s Transportation Solutions segment.

As the technical leader of the Transportation Solutions segment, Alan is responsible for the strategic direction of global engineering, technology, advanced development and innovation within the Automotive, Sensors, Application Tooling and Industrial & Commercial Transportation business units.

Alan joined TE after a 30-year career with Chrysler where he held a variety of global positions in engineering, manufacturing and service, including Head of Electrical and Electronics for Chrysler in Michigan, USA, Head of Electrical and Electronics for Fiat in Turin, Italy, Head of Global Uconnect and Global Service & Parts in Stuttgart, Germany.

Alan is the owner of two patents, is the recipient of the Walter P. Chrysler Technology Award and is a member of the SAE Convergence Technical Council where he served as the Technical Program Chair for Convergence.

Alan holds a Master of Business Administration degree, a Master of Science degree in Electrical Engineering and a Bachelor of Science degree in Electrical Engineering from the University of Michigan. He is also a graduate of the Chrysler Institute of Engineering.

Davy Brown has served as the Vice President and Chief Technology Officer for TE Connectivity’s Industrial Solutions segment since 2017.

As the technical leader of the Industrial Solutions segment, Davy is responsible for the strategic direction of global engineering and product research and innovation within the Energy, Industrial, Medical, and Aerospace, Defence and Marine businesses.

Davy first joined TE in 2013 as Vice President and Chief Technology Officer of the Telecom and Wireless businesses and continued that role after the merger and creation of Broadband Network Solutions (BNS). He then served as Senior Vice President, Research and Development of CommScope’s Connectivity Solutions business after its acquisition of BNS before returning to TE in 2017.

After beginning his career at British Telecom Research Labs, he has held senior technology leadership and executive roles in various technology companies spanning the semiconductor, software, consumer electronics and telecommunications industries. He also co-founded and served as CTO of Trinity Convergence, a multimedia communications company.

Davy holds a Bachelor’s degree in Computer Science from the University of Newcastle Upon Tyne, UK.

Phil Gilchrist has served as the Vice President and Chief Technology Officer for TE Connectivity’s Communications Solutions segment since Oct 2017.

As the technical leader of the Communications Solutions segment, Phil is responsible for the strategic direction of global engineering and innovation, product research, engineering talent and digital process development within the business units comprised in CS: Data & Devices, Appliances and SubCom.

Phil first joined TE in 2011 as Vice President and Chief Technology Officer of the Enterprise business unit, moving on to be the CTO of TE’s Datacom business unit. He then served as General Manager of Optics and CTO of Data and Devices until becoming the CTO for the Communications Solutions Segment.

After beginning his career as the Co-Founder of a technology start-up, Phil held numerous senior technology leadership and executive roles at Motorola from 1999-2011 focused on software, chipset and platform product development.

Phil holds a Bachelor’s degree (Hons) in Computer Science from the University of Stirling, Scotland.

Joe Bolewitz serves as the Vice President and Chief Technology Officer for TE Connectivity’s Industrial and Commercial Transportation Business Unit (ICT).

As the technical leader of the ICT Business Unit, he has global responsibility for sustaining engineering, development engineering, project management and advanced development.

Joe joined TE Connectivity (AMP Incorporated) in July 1988 and has held various positions in manufacturing engineering and product development within the computer, signal transmission and automotive business units of TE. He joined the ICT business unit in 2013. Prior to this role, he was responsible for global engineering of TE’s Hybrid and Electric Mobility Solutions group.

Joe holds a Bachelor of Science degree in Mechanical Engineering Technology and a Master of Business Administration degree from the Pennsylvania State University. He is a graduate of the AMP Advanced Engineers Development Program (1996-1998) as one of 4 candidates selected globally to participate in this intensive 2 year multi-discipline engineering training program.
 

Erin specializes in developing and commercializing next-gen connectivity solutions for data communications across electrical, optical, and RF domains.

Read Q&A with Erin on innovation in connectivity.

Specialty
Executing on product roadmaps to deliver differentiated value

Applications
Cloud computing
5G networking

Ask Erin about
Speed and density in data centers
Massive MIMO antennas for 5G

Greg leads a global team that develops tooling solutions for enabling high-level precision in factory connectivity.

Read Q&A with Greg on solving for innovation in tooling solutions.

Specialty
Translation of customer requests into customized solutions
Hardware and Software integration
Wire harness assembly

Applications
Crimping technologies
Pin insertion/press fit
Magnet wire
Hand tools

Ask Greg about
Improving manufacturing efficiency
Terminal connection technology
Circuit board assembly

In leading the technology vision for the TE sensors team, Byron focuses on solving for the challenge as much as for the outcome. 

Read Q&A with Byron on the forces shaping innovation in sensor technology.

Paul leads a global team that partners with customers in developing innovative solutions for the home appliance market. 

Read Q&A with Paul on the forces shaping innovation in home appliances.

Specialty
New product development
Value engineering

Applications
Large home appliances
Smart home technology

Ask Paul about
Wireless power distribution and transmission
Value engineering

Thierry specializes in developing components that enable customers to innovate.

Read Q&A with Thierry on innovation in connectivity.

Specialty
Disruptive Thinking

Ask Thierry about
High-power solutions
System solutions

Leif leads a global team that partners with customers in developing innovative solutions for optimization of power grid reliability.

Read Q&A with Leif on enabling innovation in the energy industry.

Specialty
Power grid reliability
Value engineering

Applications
Power grid connectivity
Grid protection
Substations
Smart grids

Ask Leif about
Power distribution and transmission
Energy automation
Value engineering