DesignCon 2020 Live Demo - Co-Packaging Socket Technology

Click to view a new socket technology that allows contact pitches down to 0.4mm with excellent signal integrity aimed at the developing OIF CEI-112G-XSR channel requirements. The use of these sockets allows replaceable optical engines during manufacturing of co-packaged optics and switch silicon. The co-packaging solution allows integration of TE’s thermal bridge technology for thermal management of the optics while also incorporating TE’s XLA socket technology.

LGA Sockets

Product Group

Land Grid Array (LGA) Sockets

Our portfolio features a broad range of socket solutions, including our LGA 3647 Socket family.

Product Group

Thermal Bridge Technology for Input/Output (I/O) Applications

Our innovative thermal bridge technology provides up to 2x better thermal resistance over traditional thermal technologies such as gap pads or thermal pads.