DesignCon 2020 Live Demo - Co-Packaging Socket Technology

Click to view a new socket technology that allows contact pitches down to 0.4mm with excellent signal integrity aimed at the developing OIF CEI-112G-XSR channel requirements. The use of these sockets allows replaceable optical engines during manufacturing of co-packaged optics and switch silicon. The co-packaging solution allows integration of TE’s thermal bridge technology for thermal management of the optics while also incorporating TE’s XLA socket technology.