Click video to watch TE’s XLA socket series provide high speed “LGA contact” signal performance. The growing size of large silicon packages has pushed the manufacturing of traditional plastic sockets beyond established molding limits. The XLA series is a hybrid LGA socket that solders directly to the motherboard. This hybrid socket technology utilizes a superior PCB substrate carrier allowing for reliable attachment to the mother board. A key feature of the XLA technology is its ability to address extremely large packages, in excess of 100mm x 100mm. This demonstration presents live 56G PAM4 signal performance over 1 channel with 3 aggressors.