Get to know the AMPMODU interconnect system family

Connect small

The AMPMODU 50/50 Grid connector family includes a variety of high density B-to-B and W-to-B connectors with a .050 x .050 (1,27mm x 1,27mm) pitch.


  • Categorized in three groups: board mount headers, board mount receptacles, and cable to   board receptacles
  • Available in double row, vertical or right angle, shrouded, from 10 upto 100 positions
  • Formed from high conductivity copper alloy and selectively plated with gold for higher performance and reliability
  • Housings on all board-mounted assemblies are made of high temperature tolerant materials, all available in SMD technology and incorporate stand-offs for free drainage of flux cleaning solutions
  • Integral latches for positive locking to shrouded mating headers
  • Suitable for high density systems
  • Mechanical hold downs to aid in solder processing
  • Three available board stack heights offer flexibility in mezzanine application architecture


  • Storage Equipment
  • Medical Equipment
  • Automotive Controls/Infotainment System
  • Servers
  • Test/Measurement Devices
  • Factory Automation
  • Robotics
  • Telecommunication Equipment
  • Appliances
  • Aerospace and Defense Equipment Test/Measurement Devices
  • Factory Automation
  • Telecommunication Equipment

A small System with great Benefits. A variety of components possibilities, combined with small size and outstanding quality, make AMPMODU 50/50 Grid suitable for high density systems. Parallel stacking in 3 different heights or mating with latched cable assemblies make for a reliable connection. The polarized housings add user safety and contact protection. The dual beam contact is reliable and well suited for applications subject to severe shock/vibration while the ribbon cable connectors save board space and aid in production efficiencies.