2-2013289-1 SO DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Number of Bays 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
2041119-1 Mini PCI Express & mSATA  1
  • DRAM Type Standard
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing .8
  • Product Type Connector
  • Connector Style Receptacle
  • Center Post Without
  • PCB Mount Orientation Horizontal
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Rows 2
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Location None
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) .5
  • Insertion Style Cam-In
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Mating Alignment Type Polarization
  • Boardlock Plating Material Tin
  • Centerline (Pitch) .8
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 650
1775838-2 Mini PCI Express & mSATA  1
  • DRAM Type Standard
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing .8
  • Product Type Connector
  • Connector Style Receptacle
  • Center Post Without
  • PCB Mount Orientation Vertical
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Rows 2
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Location None
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Insertion Style Cam-In
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Mating Alignment Type Polarization
  • Boardlock Plating Material Tin
  • Centerline (Pitch) .8
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 5.6
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 500
2-2013297-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Number of Bays 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 150
  • Comment With floating peg.
2-2013290-1 SO DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Number of Bays 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
1-1735583-1 Mini PCI Express & mSATA  1
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 1.27
  • Product Type Connector
  • Connector Style Receptacle
  • PCB Mount Orientation Right Angle
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 16
  • Number of Rows 1
  • Number of Keys 2
  • Ejector Location Both Ends
  • PCB Contact Termination Area Plating Material Tin
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Current Rating (Max) 1.5
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Boardlock Material Copper Alloy
  • Boardlock Plating Material Finish Matte
  • Mating Alignment Type Polarization
  • Boardlock Type Fork
  • Boardlock Plating Material Tin
  • Centerline (Pitch) 1.27
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 7.5
  • Height above PC Board 5.75
  • Operating Temperature Range -40 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Micro SATA
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 400
2286211-3 PCB Spring Contacts  1
  • Product Type Spring Finger
  • Preloaded Yes
  • Current Rating 2
  • Contact Plating Material Gold Flash
  • Contact Current Rating (Max) 4
  • Contact Plating Thickness .5
  • Uncompressed Height 2.4
  • Width 1.7
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • Packaging Method Tape & Reel
  • Packaging Quantity 5000
1775862-2 Mini PCI Express & mSATA
  • DRAM Type Standard
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing .8
  • Product Type Connector
  • Connector Style Receptacle
  • Center Post Without
  • PCB Mount Orientation Horizontal
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Rows 2
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Location None
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Insertion Style Cam-In
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Mating Alignment Type Polarization
  • Boardlock Plating Material Tin
  • Centerline (Pitch) .8
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 550
2-2013310-1 SO DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Number of Bays 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 150
  • Comment With floating peg.
2-2013311-1 SO DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Number of Bays 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 150
  • Comment With floating peg.
1-1735583-2 Mini PCI Express & mSATA
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 1.27
  • Product Type Connector
  • Connector Style Receptacle
  • PCB Mount Orientation Right Angle
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 16
  • Number of Rows 1
  • Number of Keys 2
  • Ejector Location Both Ends
  • PCB Contact Termination Area Plating Material Tin
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Current Rating (Max) 1.5
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Boardlock Material Copper Alloy
  • Boardlock Plating Material Finish Matte
  • Mating Alignment Type Polarization
  • Boardlock Type Fork
  • Boardlock Plating Material Tin
  • Centerline (Pitch) 1.27
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 7.5
  • Height above PC Board 5.75
  • Operating Temperature Range -40 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Micro SATA
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 400
1-1735583-3 Mini PCI Express & mSATA
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 1.27
  • Product Type Connector
  • Connector Style Receptacle
  • PCB Mount Orientation Right Angle
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 16
  • Number of Rows 1
  • Number of Keys 2
  • Ejector Location Both Ends
  • PCB Contact Termination Area Plating Material Tin
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Current Rating (Max) 1.5
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Boardlock Material Copper Alloy
  • Boardlock Plating Material Finish Matte
  • Mating Alignment Type Polarization
  • Boardlock Type Fork
  • Boardlock Plating Material Tin
  • Centerline (Pitch) 1.27
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 7.5
  • Height above PC Board 5.75
  • Operating Temperature Range -40 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Micro SATA
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 400
2-2013298-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Number of Bays 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 150
  • Comment With floating peg.