2102061-2 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 6
  • Row-to-Row Spacing 1.27
  • Stack Height 10
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 450
  • Packaging Method Tape & Reel
2102061-1 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 6
  • Row-to-Row Spacing 1.27
  • Stack Height 10
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 450
  • Packaging Method Tape & Reel
2102060-2 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Header
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Phosphor Bronze
  • Contact Shape & Form Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Pin
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 9.15
  • Row-to-Row Spacing 1.27
  • Stack Height 10
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 230
  • Packaging Method Tape & Reel
2102061-9 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 14
  • Row-to-Row Spacing 1.27
  • Stack Height 18
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 100
  • Packaging Method Tape & Reel
2102060-1 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Header
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Shape & Form Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Pin
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 9.15
  • Row-to-Row Spacing 1.27
  • Stack Height 10
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 230
  • Packaging Method Tape & Reel
2102060-3 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Header
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Shape & Form Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .76
  • Contact Type Pin
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 9.15
  • Row-to-Row Spacing 1.27
  • Stack Height 10
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 230
  • Packaging Method Tape & Reel
2102061-3 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 8
  • Row-to-Row Spacing 1.27
  • Stack Height 12
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 350
  • Packaging Method Tape & Reel
2102061-4 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 8
  • Row-to-Row Spacing 1.27
  • Stack Height 12
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 350
  • Packaging Method Tape & Reel
2102079-2 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Header
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 60
  • Contact Base Material Phosphor Bronze
  • Contact Shape & Form Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Pin
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 9.15
  • Row-to-Row Spacing 1.27
  • Stack Height 10
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Packaging Quantity 230
  • Packaging Method Tape & Reel
1-2102061-0 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 14
  • Row-to-Row Spacing 1.27
  • Stack Height 18
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 100
  • Packaging Method Tape & Reel
1-2102061-3 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 11
  • Row-to-Row Spacing 1.27
  • Stack Height 15
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 230
  • Packaging Method Tape & Reel
1-2102061-6 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .76
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 11
  • Row-to-Row Spacing 1.27
  • Stack Height 15
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 230
  • Packaging Method Tape & Reel
1-2102430-2 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Rows 8
  • PCB Mount Orientation Vertical
  • Number of Positions 320
  • Board-to-Board Configuration Mezzanine
  • Data Rate 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin-Silver-Copper
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .076
  • Contact Type Socket
  • Contact Current Rating (Max) 1.5
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Type None
  • Mating Alignment With
  • Mating Alignment Type Polarizing Rib
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Row-to-Row Spacing 1.27
  • Stack Height 18
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Packaging Method Pocket Tape
2102061-5 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .76
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 6
  • Row-to-Row Spacing 1.27
  • Stack Height 10
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 450
  • Packaging Method Tape & Reel
2102061-6 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .76
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 6
  • Row-to-Row Spacing 1.27
  • Stack Height 10
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 450
  • Packaging Method Tape & Reel
2102061-8 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 114
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .76
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 8
  • Row-to-Row Spacing 1.27
  • Stack Height 12
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Industry Standard VITA 61
  • Packaging Quantity 350
  • Packaging Method Tape & Reel
2102079-1 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Header
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 60
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Shape & Form Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Pin
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 9.15
  • Row-to-Row Spacing 1.27
  • Stack Height 10
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Packaging Quantity 230
  • Packaging Method Tape & Reel
2102080-1 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 60
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Shape & Form Round
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Contact Current Rating (Max) 1.5
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Type Solder Ball
  • Mating Alignment With
  • Mating Alignment Type Polarizing Tab
  • PCB Mount Retention With
  • Mating Entry Location Top
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 5.75
  • Row-to-Row Spacing 1.27
  • Stack Height 10
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Packaging Quantity 450
  • Packaging Method Reel
2102080-4 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stackable Yes
  • Number of Rows 6
  • PCB Mount Orientation Vertical
  • Number of Positions 60
  • Contact Base Material Beryllium Copper
  • Contact Shape & Form Round
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Contact Current Rating (Max) 1.5
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Type Solder Ball
  • Mating Alignment With
  • Mating Alignment Type Polarizing Tab
  • PCB Mount Retention With
  • Mating Entry Location Top
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Height 7.75
  • Row-to-Row Spacing 1.27
  • Stack Height 12
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Packaging Quantity 350
  • Packaging Method Reel
2102429-1 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Rows 8
  • PCB Mount Orientation Vertical
  • Number of Positions 320
  • Board-to-Board Configuration Mezzanine
  • Data Rate 10
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .127
  • Contact Type Pin
  • Contact Current Rating (Max) 1.5
  • Termination Method to Printed Circuit Board Surface Mount - Solder Ball
  • PCB Mount Retention Type None
  • Mating Alignment With
  • Mating Alignment Type Polarizing Slot
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Row-to-Row Spacing 1.27
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Packaging Method Pocket Tape