2308107-8 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Base Material Copper Alloy
  • Contact Current Rating (Max) .75
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Soft Tray
2199155-1 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Current Rating (Max) .75
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Hard Tray
2308107-1 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) .75
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Soft Tray
2308107-2 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Base Material Copper Alloy
  • Contact Current Rating (Max) .75
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Soft Tray
2308107-3 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Base Material Copper Alloy
  • Contact Current Rating (Max) .75
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Soft Tray
2308107-4 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Base Material Copper Alloy
  • Contact Current Rating (Max) .75
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Soft Tray
2308107-6 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Base Material Copper Alloy
  • Contact Current Rating (Max) .75
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Soft Tray
2308107-7 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Base Material Copper Alloy
  • Contact Current Rating (Max) .75
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Soft Tray
1-2308107-0 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Base Material Copper Alloy
  • Contact Current Rating (Max) .75
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Soft Tray
2199155-3 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Current Rating (Max) .75
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Hard Tray
2308107-5 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Base Material Copper Alloy
  • Contact Current Rating (Max) .75
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Soft Tray
2308107-9 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Base Material Copper Alloy
  • Contact Current Rating (Max) .75
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Soft Tray
2309407-1 SO DIMM Sockets  1
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile Low
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Module Orientation Right Angle
  • Number of Positions 260
  • Number of Rows 2
  • Ejector Type Locking
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • Packaging Method Tape & Reel
2309407-2 SO DIMM Sockets  1
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile Low
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Module Orientation Right Angle
  • Number of Positions 260
  • Number of Rows 2
  • Ejector Type Locking
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .127
  • Contact Current Rating (Max) .5
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • Packaging Method Tape & Reel
2309408-1 SO DIMM Sockets  1
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile Low
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Module Orientation Right Angle
  • Number of Positions 260
  • Number of Rows 2
  • Ejector Type Locking
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • Packaging Method Tape & Reel
2309408-2 SO DIMM Sockets  1
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile Low
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Module Orientation Right Angle
  • Number of Positions 260
  • Number of Rows 2
  • Ejector Type Locking
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .127
  • Contact Current Rating (Max) .5
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • Packaging Method Tape & Reel
2309409-1 SO DIMM Sockets  1
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile Low
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Module Orientation Right Angle
  • Number of Positions 260
  • Number of Rows 2
  • Ejector Type Locking
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • Packaging Method Tape & Reel
2309409-2 SO DIMM Sockets  1
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile Low
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Module Orientation Right Angle
  • Number of Positions 260
  • Number of Rows 2
  • Ejector Type Locking
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .127
  • Contact Current Rating (Max) .5
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • Packaging Method Tape & Reel
2309410-1 SO DIMM Sockets  1
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile Low
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Ejector Type Locking
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • Packaging Method Tape & Reel
2309410-2 SO DIMM Sockets  1
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile Low
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Ejector Type Locking
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .127
  • Contact Current Rating (Max) .5
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • Packaging Method Tape & Reel