2299804-1 IC Socket Hardware  1
  • Accessory Type Bolster Assembly
  • Bolster Plate Assembly Material Stainless Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
  • Comment Narrow Type with Cover.
2-2129710-7 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1824
  • Grid Spacing .9906 x .8585
  • Plating Material Gold
  • Frame Style C Shape
  • Plating Thickness 30
  • Contact Base Material Copper Alloy
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2299805-1 IC Socket Hardware  1
  • Accessory Type Backplate
  • Plating Material Nickel
  • Backplate Material Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
  • Comment Backplate Assembly
2-2129710-5 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1824
  • Grid Spacing .9906 x .8585
  • Plating Material Gold
  • Frame Style C Shape
  • Plating Thickness 30
  • Contact Base Material Copper Alloy
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2-2129710-6 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1823
  • Grid Spacing .9906 x .8585
  • Plating Material Gold
  • Frame Style C Shape
  • Plating Thickness 30
  • Contact Base Material Copper Alloy
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball
2299805-3 IC Socket Hardware  1
  • Accessory Type Backplate
  • Plating Material Nickel
  • Backplate Material Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
  • Comment Backplate Assembly
2299804-3 IC Socket Hardware  1
  • Accessory Type Bolster Assembly
  • Bolster Plate Assembly Material Stainless Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
  • Comment Narrow Type without Cover.
2299806-1 IC Socket Covers  1
  • Accessory Type Carrier
  • PQFP Type Metric
  • Cover Material PC + ABS
  • Color Black
  • Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Cover Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
2305234-1 IC Socket Covers  1
  • Accessory Type Dust Cover
  • PQFP Type Metric
  • Cover Material PC + ABS
  • Color Black
  • Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Cover Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
2-2822979-3 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 3647
  • Grid Spacing .9906 x .8585
  • Plating Material Gold
  • Frame Style Square
  • Plating Thickness 30
  • Contact Base Material Copper Alloy
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Comment Lead-Free Solderball
2310927-1 IC Socket Covers  1
  • Accessory Type Carrier
  • PQFP Type Metric
  • Cover Material PC + ABS
  • Color Black
  • Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Cover Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
2310924-3 IC Socket Hardware  1
  • Accessory Type Bolster Assembly
  • Bolster Plate Assembly Material Stainless Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
  • Comment Narrow Type without Cover.
2-2129710-8 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1823
  • Grid Spacing .9906 x .8585
  • Plating Material Gold
  • Frame Style C Shape
  • Plating Thickness 30
  • Contact Base Material Copper Alloy
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball
2310924-1 IC Socket Hardware  1
  • Accessory Type Bolster Assembly
  • Bolster Plate Assembly Material Stainless Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
  • Comment Narrow Type with Cover.
2-2129710-2 LGA Sockets  1
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1823
  • Grid Spacing .9906 x .8585
  • Plating Material Gold
  • Frame Style C Shape
  • Plating Thickness 15
  • Contact Base Material Copper Alloy
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball
2-2822979-4 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 3647
  • Grid Spacing .9906 x .8585
  • Plating Material Gold
  • Frame Style Square
  • Plating Thickness 30
  • Contact Base Material Copper Alloy
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Comment Lead-Free Solderball
2-2129710-1 LGA Sockets  1
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1824
  • Grid Spacing .9906 x .8585
  • Plating Material Gold
  • Frame Style C Shape
  • Plating Thickness 15
  • Contact Base Material Copper Alloy
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball