1571424-2 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Plug
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 16
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 16
  • Board-to-Board Configuration Vertical
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Termination Resistance 12
  • Dielectric Withstanding Voltage (Max) 300
  • Assembly Process Feature Material Aluminum
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Underplating Material Nickel
  • Contact Shape & Form Dual
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .76
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Layout Inline
  • Termination Post & Tail Length 2.46
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • PCB Mount Retention Type Hold-Down
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Hold-Down
  • Mating Entry Location Top
  • Centerline (Pitch) 1.27
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Width 5.72
  • Connector Height 5.73
  • Row-to-Row Spacing 1.27
  • Stack Height 6.35
  • PCB Thickness (Recommended) 1.57
  • Connector Length 13.25
  • Operating Temperature Range -65 – 105
  • Housing Temperature Rating High
  • Assembly Process Feature Vacuum Cover
  • Circuit Application Signal
  • Agency/Standard CSA
  • CSA Certified Yes
  • CSA File Number LR7189
  • UL File Number E28476
  • Packaging Quantity 3200
  • Packaging Method Tube
1571424-5 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Plug
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Shrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 50
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 50
  • Board-to-Board Configuration Vertical
  • Insulation Resistance 5000
  • Termination Resistance 12
  • Dielectric Withstanding Voltage (Max) 300
  • Assembly Process Feature Material Aluminum
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Underplating Material Nickel
  • Contact Shape & Form Dual
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .76
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Layout Inline
  • Termination Post & Tail Length 2.46
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • PCB Mount Retention Type Hold-Down
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Hold-Down
  • Mating Entry Location Top
  • Centerline (Pitch) 1.27
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Width 5.72
  • Connector Height 5.73
  • Row-to-Row Spacing 1.27
  • Stack Height 6.35
  • PCB Thickness (Recommended) 1.57
  • Connector Length 9.44
  • Operating Temperature Range -65 – 105
  • Housing Temperature Rating High
  • Assembly Process Feature Vacuum Cover
  • Circuit Application Signal
  • Agency/Standard CSA
  • CSA Certified Yes
  • CSA File Number LR7189
  • UL File Number E28476
  • Packaging Quantity 1200
  • Packaging Method Tube
5-1571424-2 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Plug
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 16
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 16
  • Board-to-Board Configuration Vertical
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Termination Resistance 12
  • Dielectric Withstanding Voltage (Max) 300
  • Assembly Process Feature Material Aluminum
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Dual
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Layout Inline
  • Termination Post & Tail Length 2.46
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • PCB Mount Retention Type Hold-Down
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Hold-Down
  • Mating Entry Location Top
  • Centerline (Pitch) 1.27
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Width 5.72
  • Connector Height 5.73
  • Row-to-Row Spacing 1.27
  • Stack Height 6.35
  • PCB Thickness (Recommended) 1.57
  • Connector Length 13.25
  • Operating Temperature Range -65 – 105
  • Housing Temperature Rating High
  • Assembly Process Feature Vacuum Cover
  • Circuit Application Signal
  • Agency/Standard CSA
  • CSA Certified Yes
  • CSA File Number LR7189
  • UL File Number E28476
  • Packaging Quantity 3200
  • Packaging Method Tube
5-1571424-5 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Plug
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Shrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 10
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 10
  • Board-to-Board Configuration Vertical
  • Insulation Resistance 5000
  • Termination Resistance 12
  • Dielectric Withstanding Voltage (Max) 300
  • Assembly Process Feature Material Aluminum
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Dual
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Layout Inline
  • Termination Post & Tail Length 2.46
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • PCB Mount Retention Type Hold-Down
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Hold-Down
  • Mating Entry Location Top
  • Centerline (Pitch) 1.27
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Connector Width 5.72
  • Connector Height 5.73
  • Row-to-Row Spacing 1.27
  • Stack Height 6.35
  • PCB Thickness (Recommended) 1.57
  • Connector Length 9.44
  • Operating Temperature Range -65 – 105
  • Housing Temperature Rating High
  • Assembly Process Feature Vacuum Cover
  • Circuit Application Signal
  • Agency/Standard CSA
  • CSA Certified Yes
  • CSA File Number LR7189
  • UL File Number E28476
  • Packaging Quantity 4560
  • Packaging Method Tube
1-2331928-0 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 20
  • Number of Loaded Positions 20
  • Number of Columns 10
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 20
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-1 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 22
  • Number of Columns 11
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 22
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-2 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 24
  • Number of Loaded Positions 24
  • Number of Columns 12
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-3 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 26
  • Number of Columns 13
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 26
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-5 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 30
  • Number of Loaded Positions 30
  • Number of Columns 15
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 30
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-7 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 34
  • Number of Columns 17
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 34
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-9 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 38
  • Number of Loaded Positions 38
  • Number of Columns 19
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 38
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2-2331928-0 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 40
  • Number of Loaded Positions 40
  • Number of Columns 20
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2-2331928-5 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 50
  • Number of Columns 25
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 50
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2267465-1 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 100
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 100
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 100
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Termination Resistance 16
  • Dielectric Withstanding Voltage (Max) 1000
  • Assembly Process Feature Material Stainless Steel
  • Post Size .24 x .55
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangle
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Protection Type Closed Entry Housing
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 50.6
  • Operating Temperature Range -55 – -125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2267465-3 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 6
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 6
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 6
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Termination Resistance 16
  • Dielectric Withstanding Voltage (Max) 1000
  • Assembly Process Feature Material Stainless Steel
  • Post Size .24 x .55
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangle
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Protection Type Closed Entry Housing
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 3.6
  • Operating Temperature Range -55 – -125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-1 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 100
  • Number of Loaded Positions 100
  • Number of Columns 50
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 100
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-2 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 4
  • Number of Loaded Positions 4
  • Number of Columns 2
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 4
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-3 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 6
  • Number of Columns 3
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 6
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-4 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 8
  • Number of Loaded Positions 8
  • Number of Columns 4
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 8
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-5 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 10
  • Number of Columns 5
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 10
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube