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Defense and Military
Next-Generation Antenna Design
Recent advances in materials and fabrication technologies are now enabling improved antenna designs with reduced size, weight, aerodynamic drag, and cost.
Michael Walmsley is a Global Product Manager in the Aerospace, Defense and Marine business unit. His areas of expertise include interconnect solutions for embedding computing, rugged high speed board level and RF Connectors.
Conductively-coated composite technology is leading to cost-effective and robust antennas and arrays in conformal, lightweight form factors suitable for next-generation unmanned platforms.
In UAVs, sophisticated sensors provide more bandwidth, and light-weight on-board networks are enabling UAVs to loiter on station longer and carry heavier payloads.
Today’s UAV subsystems demand high bandwidths combined with low SWaP. VPX technology provides the performance and ruggedness to satisfy these demands.
Wireless ghost connections make data and power transmissions without physical contacts a reality.
Recent tests by NASA's Jet Propulsion Laboratory (JPL) and Goddard Space Flight Center show that new nano-carbon crosslinked ethylene tetrafluoroethylene (ETFE) helps controls electrostatic discharge (ESD) in wires and cables used on
TE has been actively researching CNT for wire and cable, including cooperative efforts with universities and industry leaders, and has prototypes samples for evaluation. While there is still much progress to be made before CNT cables become main stream, we believe the technology is sufficiently advanced to meet specific niche applications such as satellites.
The naval environment involves unique challenges – pressure, flooding, corrosion – for reliably powering UUVs and USVs. TE's connectivity solutions are designed to address these challenges.
More. That’s the essence of pushing the performance envelope. For designers of embedded computer systems in military and aerospace applications, “more” means higher processing speeds to handle the ever-increasing complexity of signal intelligence and networked warfare. This, in turn, requires connectors that not only can handle the higher data rates, but also operate reliably in the harshest environments.
The rapid advances in radio frequency (RF) technology after World War II provided the building blocks for the highly agile radar and high-speed communications systems in use today. Innovations in RF signal processing, integrated electronics, and miniaturization of interconnects have contributed to the evolution of radar from large and cumbersome narrow-bandwidth systems requiring mechanical articulation of the antennae to locate and track targets, to the active electronically scanned array (AESA) radar systems in use today.
As a young, vibrant, and rapidly expanding ecosystem, VPX benefits from the global backing of both the computing and aerospace/defense industries. This widespread backing has driven the standardization to move forward relatively efficiently, with many participants at the various levels of supply chain – components, subsystems and platforms. A key to the success of VPX has been the heavy reliance on commercial off-the-shelf products, fostering a wide international supplier base, shortening time to market and further feeding the ecosystem’s evolution.
Heat-shrink tubing has been a staple in the electronics industry for more than 50 years. It is used for sealing, protecting, insulating, strain-relieving, and identifying wires and cables.
A new generation of miniature and nanominiature connectors now supports the needs of high-speed I/O, for 100-ohm data busses like Gigabit and 10G Ethernet. Such connectors use robust designs already time tested in adverse environments to cancel noise, decrease crosstalk, and maintain signal integrity.
A growing trend in electronic packaging for military and aerospace applications is the availability of multi-contact coaxial interconnects. A key driver is the desire to provide RF disconnect capability at the backplane/daughtercard interface. This simplifies engagement and disengagement by eliminating the need for the cables on the front panel (top side of the daughtercard).