DesignCon 2019: Enabling Co-Packaged Optics with TE Socket Technology

Motivated by the need for lower power consumption resulting in better cost efficiency SERDES power reduced due to shorter electrical channel (compared to pluggable I/O) Increases I/O bandwidth density TE socket technology enables a separable interface to optimize manufacturing yield High Speed LGA contact technology allows a 100Gbps interconnection between switch and optics by directly interfacing to the ASIC substrate Cover over ASIC package allows for proper alignment during mating and mechanical retention of modules Solution allows for various thermal management techniques including air-cooled heatsinks and direct liquid cooling