1-2331928-0 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 20
  • Number of Loaded Positions 20
  • Number of Columns 10
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 20
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-1 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Loaded Positions 22
  • Number of Columns 11
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 22
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-2 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 24
  • Number of Loaded Positions 24
  • Number of Columns 12
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-3 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Loaded Positions 26
  • Number of Columns 13
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 26
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-5 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 30
  • Number of Loaded Positions 30
  • Number of Columns 15
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 30
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-7 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Loaded Positions 34
  • Number of Columns 17
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 34
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-9 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 38
  • Number of Loaded Positions 38
  • Number of Columns 19
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 38
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2-2331928-0 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 40
  • Number of Loaded Positions 40
  • Number of Columns 20
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2-2331928-5 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Loaded Positions 50
  • Number of Columns 25
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 50
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-1 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 100
  • Number of Loaded Positions 100
  • Number of Columns 50
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 100
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-2 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 4
  • Number of Loaded Positions 4
  • Number of Columns 2
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 4
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-3 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Loaded Positions 6
  • Number of Columns 3
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 6
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-4 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 8
  • Number of Loaded Positions 8
  • Number of Columns 4
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 8
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-5 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Loaded Positions 10
  • Number of Columns 5
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 10
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-6 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 12
  • Number of Loaded Positions 12
  • Number of Columns 6
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 12
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-7 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Loaded Positions 14
  • Number of Columns 7
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 14
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-8 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 16
  • Number of Loaded Positions 16
  • Number of Columns 8
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 16
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
2331928-9 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Loaded Positions 18
  • Number of Columns 9
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 18
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
3-2331928-0 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Signal Positions 60
  • Number of Loaded Positions 60
  • Number of Columns 30
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 60
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
3-2331928-5 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Series AMPMODU
  • Make First / Break Last No
  • Number of Loaded Positions 70
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 70
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Cover Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Finish Matte
  • Mating Post Length 1.9
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Underplating Material Thickness 1.27
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board SMD Soldering
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube