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Overview
TE Innovations at DesignCon 2018

Industry Tradeshow

DesignCon 2018 Expo

January 31, 2018 - February 1, 2018

Santa Clara Convention Center
Santa Clara, CA

Booth 817

BIG IDEAS FOR EVEN BIGGER DATA. TE understands the unique challenges technology designers face when trying to keep up with the rapid changes in the marketplace. TE’s portfolio of advanced, reliable connectors and other components offer solutions for speed, density, power and connectivity and are driving the next generation of data center applications. See below for links to videos of our demonstrations highlighting performance and next-generation solutions for data centers and the latest products delivering the speed, scalability, space-savings, reduced thermals, power and reach that you need for your next project.

2018 Featured Products and Demos

  • The Sliver Interconnect Family (Sliver 2.0) has been identified as the standard and required product through several industry groups like COBO, GenZ, EDSFF and Open Compute for today and next gen server and storage designs.  
  • QSFP-DD, OSFP, Copper Cables and microQSFP high-speed I/O solutions with demonstrations on thermal performance, RU faceplate density and data throughput capabilities.
  • The industry leading STRADA Whisper high speed backplane connectors, with a continuously expanded range of configurations including direct plug orthogonal, mezzanine, and cables all delivering at 56Gbps, 112Gbps and beyond.
TE is solving the serious challenges our customers face for their new hardware requirements; signal integrity, packaging density, power delivery, thermal management, we are delivering them all.
Nathan Tracy,
Standards Manager
  1. The Innovation Behind microQSFP (English)

Watch now to learn more about microQSFP.

TE Innovations at DesignCon 2018

Industry Tradeshow

DesignCon 2018 Expo

January 31, 2018 - February 1, 2018

Santa Clara Convention Center
Santa Clara, CA

Booth 817

BIG IDEAS FOR EVEN BIGGER DATA. TE understands the unique challenges technology designers face when trying to keep up with the rapid changes in the marketplace. TE’s portfolio of advanced, reliable connectors and other components offer solutions for speed, density, power and connectivity and are driving the next generation of data center applications. See below for links to videos of our demonstrations highlighting performance and next-generation solutions for data centers and the latest products delivering the speed, scalability, space-savings, reduced thermals, power and reach that you need for your next project.

2018 Featured Products and Demos

  • The Sliver Interconnect Family (Sliver 2.0) has been identified as the standard and required product through several industry groups like COBO, GenZ, EDSFF and Open Compute for today and next gen server and storage designs.  
  • QSFP-DD, OSFP, Copper Cables and microQSFP high-speed I/O solutions with demonstrations on thermal performance, RU faceplate density and data throughput capabilities.
  • The industry leading STRADA Whisper high speed backplane connectors, with a continuously expanded range of configurations including direct plug orthogonal, mezzanine, and cables all delivering at 56Gbps, 112Gbps and beyond.
TE is solving the serious challenges our customers face for their new hardware requirements; signal integrity, packaging density, power delivery, thermal management, we are delivering them all.
Nathan Tracy,
Standards Manager
  1. The Innovation Behind microQSFP (English)

Watch now to learn more about microQSFP.